# APCC Shift Operations Manager at Intel

Intel is hiring an APCC Shift Operations Manager. Level rates it Little AI ●○○○; you can [apply on Intel](https://jobsbylevel.com/go/4fdb418c-6803-4106-a532-027a1713442c?utm_medium=ai-agent).

AI Level 1, AI centrality 0 out of 100. Malaysia, Penang.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 0 out of 100)
- Location: Malaysia, Penang
- Posted: November 4, 2026
- Apply: https://jobsbylevel.com/go/4fdb418c-6803-4106-a532-027a1713442c?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=apcc-shift-operations-manager-at-intel-f66cfe

## Prepare for this job

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## Description

Job Details: Job Description: The Advanced Packaging Command Center (APCC) Shift Group Leader is a people manager responsible for leading a shift-based operations team that provides remote manufacturing and technical support to factory operations. This role ensures safe, reliable, disciplined and consistent execution of APCC services while maintaining strong partnership with supported factory teams and global stakeholders. The Shift Group Leader is accountable for people leadership, shift execution, operational performance, service quality, escalation management, capability development and continuous improvement. The role requires sound decision-making in a fast-paced manufacturing environment where priorities change rapidly, supported by a solid understanding of the semiconductor manufacturing flow to lead defect-related operational response and drive cross-functional problem solving across APCC and supported factories. Key Responsibilities People and Shift Leadership - Lead, supervise and develop APCC Technicians, Commanders and Runners supporting remote factory operations across assigned sites, technologies and service areas. - Own core people-management responsibilities, including onboarding, goal setting, performance management, recognition and handling of employee relations matters. - Ensure effective 24/7 shift operations, including staffing, attendance, overtime management, workload balancing, shift coverage and task prioritization. - Provide clear leadership and direction during rapidly changing manufacturing situations, balancing operational priorities, technical risk and service commitments. - Ensure team members complete required training and certification (e.g., L1O/L2O) and that training materials remain current with the latest specs and processes. - Build team capability through coaching, knowledge sharing, technical development and disciplined execution of standard work. - Establish an environment of safety, accountability, teamwork, continuous learning and effective cross-functional collaboration. Operational Execution and Escalation Management - Ensure timely response, acknowledgement, disposition and escalation of manufacturing or technical events in accordance with established procedures and service expectations. - Enforce compliance with the operating spec, escalation timelines and follow-up expectations. - Coordinate work across APCC, factory operations, engineering, equipment, automation, manufacturing and other stakeholder organizations, including global sites across time zones, to ensure issues are properly owned and resolved. - Serve as the primary shift leadership escalation point for operational abnormalities, high-impact events, staffing constraints, service disruptions and issues requiring management intervention. - Maintain effective shift-to-shift handover, ensuring significant events, open actions, risks and escalation status are clearly communicated. - Provide shift reports and operations review inputs and communicate significant events to management and site stakeholders. - Ensure compliance with EHS, information security, access control and data integrity requirements. Technical Leadership - Provide shift leadership for quality/Yield-related manufacturing events, ensuring appropriate initial assessment, containment, escalation, ownership and follow-through in partnership with manufacturing, process, yield, quality and engineering teams. - Apply knowledge of the semiconductor manufacturing flow to understand how upstream process conditions in wafer fabrication, wafer-level packaging and sort/test may appear as downstream defect or yield signals. - Use problem solving methodology and technical data to guide problem definition, challenge defect classification and disposition where needed, and route issues to the appropriate engineering owners. - Distinguish immediate operational containment needs from issues requiring deeper engineering investigation,and ensure repeat or systematic defects

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