# Die Sort Module Engineer at Intel

Intel is hiring a Die Sort Module Engineer. It pays $104k-$146k a year and Level rates it Little AI ●○○○; you can [apply on Intel](https://jobsbylevel.com/go/61ae2324-5a14-4ac0-8ac9-81bc6959c1ea?utm_medium=ai-agent).

AI Level 1, AI centrality 38 out of 100. US, New Mexico, Albuquerque.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 38 out of 100)
- Location: US, New Mexico, Albuquerque
- Salary: $104k-$146k
- Posted: October 28, 2026
- Apply: https://jobsbylevel.com/go/61ae2324-5a14-4ac0-8ac9-81bc6959c1ea?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=die-sort-module-engineer-at-intel-4a1e41

## Description

Job Details: Job Description: The Role and Impact New Mexico is Intel's flagship high-volume Advanced Packaging manufacturing site, providing full co-location of the Advanced Packaging line at a single site, with New Mexico Die Sort (NM DS) serving as a key segment of the manufacturing operation. As a Die Sort Module Engineer, you will play an essential role in ensuring the efficiency and reliability of high-volume manufacturing equipment and processes that support Intel's advanced semiconductor production. You will be responsible for monitoring, maintaining, troubleshooting, and optimizing semiconductor sort equipment to meet quality, safety, and operational goals while contributing to the development and implementation of innovative process solutions. Your work will directly impact Intel's ability to deliver cutting-edge technologies at scale, supporting both current and future semiconductor manufacturing needs. This position offers an opportunity to contribute to Intel's foundry and Advanced Packaging success while driving innovation, process improvements, and operational excellence. Key Responsibilities Own and optimize sort equipment performance, including advanced troubleshooting, preventive maintenance and repair improvements, process monitoring, data analysis, and excursion response. Drive improvements in safety, quality, equipment availability, yield, cost, standardization, process control, and manufacturability. Develop, implement, and optimize recipes for new product introductions (NPIs) and existing production processes. Partner with Technology Development (TD) teams to transfer and optimize new processes and technologies. Explore and develop improved semiconductor sort/test methodologies and techniques to support new and emerging technologies. Perform root-cause analysis and implement corrective actions for integrated processing issues in collaboration with other modules, upstream and downstream partners, and cross-functional engineering teams. Collaborate with Virtual Factory (VF) partners to drive and implement global process and operational improvements. Provide training, mentoring, and coaching to technicians while maintaining a customer-oriented approach to manufacturing support and promoting innovation and collaboration. Oversee the installation, qualification, and maintenance of new and existing equipment during factory ramps. Develop and maintain strong partnerships with internal teams and external equipment vendors and technology developers. Desired Skills and Behavioral Traits Demonstrated experience with statistical process control methodologies and engineering analysis tools. Interest in and demonstrated hands-on experience with semiconductor process and equipment troubleshooting, repair, and/or development. Proficiency in model-based problem-solving and root-cause analysis methodologies, including MBPS, DOE, FMEA, or equivalent approaches. Strong verbal and written communication skills, with the ability to influence peers and managers and communicate complex technical information clearly and concisely. Demonstrated disciplined execution and the ability to act with an appropriate level of urgency. Results-oriented, organized, resourceful, and self-directed, with the ability to demonstrate initiative and work independently. Strong attention to quality and detail, with the ability to maintain high standards in manufacturing operations. Ability to adapt to new and frequently changing challenges in a high-volume manufacturing environment. Ability to manage multiple priorities across process engineering, equipment sustaining, continuous improvement, process transfer, and Virtual Factory activities. Ability to work effectively within and across organizations, including leading and participating in cross-functional team efforts. Demonstrated ability to develop, qualify, and implement process and/or hardware improvements. Ability to successfully plan, develop, and execute projects lasting two or more months.

The description is cut here. Read the full offer: https://jobsbylevel.com/jobs/die-sort-module-engineer-at-intel-4a1e41

Source: https://jobsbylevel.com/jobs/die-sort-module-engineer-at-intel-4a1e41

## Cite this page

Level. https://jobsbylevel.com/jobs/die-sort-module-engineer-at-intel-4a1e41.

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