# Lead Software Engineer - Build & Release at Logitech

Logitech is hiring a Lead Software Engineer - Build & Release. Level rates it Little AI ●○○○; you can [apply on Logitech](https://jobsbylevel.com/go/940f0bc6-712c-411d-a77c-08253cc42f1e?utm_medium=ai-agent).

AI Level 1, AI centrality 31 out of 100. Hsinchu, Taiwan.

## Details

- Company: [Logitech](https://jobsbylevel.com/companies/logitech)
- AI level: AI Level 1 (score 31 out of 100)
- Location: Hsinchu, Taiwan
- Posted: July 28, 2026
- Apply: https://jobsbylevel.com/go/940f0bc6-712c-411d-a77c-08253cc42f1e?utm_medium=ai-agent

## Description

Logitech is the Sweet Spot for people who want their actions to have a positive global impact while having the flexibility to do it in their own way. The role and team: At Logitech, our Build & Infrastructure team enables software development across a diverse portfolio of Android-based collaboration products. We are responsible for delivering scalable, reliable, and secure build and release infrastructure that supports engineering teams throughout the software development lifecycle. We are looking for a Lead Software Engineer - Build & Release who is passionate about automation, developer productivity, and continuous integration. You will design, build, and maintain the systems that enable engineers to efficiently develop, build, test, and release software while continuously improving the scalability, reliability, and security of our engineering infrastructure. This role works closely with software engineering teams, chipset vendors, and ODM partners to support platform bring-up, Android BSP integration, build automation, and product releases across multiple hardware platforms. Your Contribution: Be Yourself. Be Open. Stay Hungry and Humble. Collaborate. Challenge. Decide and just Do. Share our passion for Equality and the Environment. These are the behaviors and values you’ll need for success at Logitech. In this role you will: Design, develop, and maintain scalable CI/CD pipelines supporting Android software development and product releases. Build and maintain automation for software builds, testing, packaging, and release processes. Optimize build performance, reliability, and developer productivity across multiple engineering teams. Administer and enhance engineering tools including Git, Gerrit, GitHub, Jenkins, artifact repositories, and related build infrastructure. Support release engineering activities including branching strategies, build generation, release automation, software version management, and release candidate creation. Partner with software engineering teams, chipset vendors (e.g., Qualcomm and MediaTek), and ODM partners to support platform bring-up, BSP integration, software releases, and continuous improvement of development processes. Develop tools and automation that improve engineering workflows, reduce manual effort, and increase development efficiency. Monitor, maintain, and improve the availability, security, scalability, and performance of build infrastructure. Leverage AI and automation technologies to streamline software development, build analysis, troubleshooting, and developer workflows. Key Qualifications: For consideration, you must bring the following minimum skills and experiences to our team: Bachelor's or Master's degree in Computer Science, Computer Engineering, or related field. 5+ years of experience in Build Engineering, Release Engineering, DevOps, Software Engineering working in the enterprise Android ecosystem Experience collaborating with silicon vendors (e.g., Qualcomm, MediaTek) and ODM/OEM partners to integrate platform updates and resolve build and release issues. Strong experience with Git, Gerrit, GitHub, and modern source control workflows. Experience developing CI/CD pipelines using Jenkins or similar automation platforms. Strong experience with Android build systems including Soong, Make, Gradle, Repo, and Android platform build environments. Strong scripting skills using Python, Bash, or similar languages. Strong Linux system administration and troubleshooting experience. Experience working with build automation, release management, and software versioning. Strong analytical, debugging, and problem-solving skills. Excellent communication and collaboration skills. Preferred Qualifications: Experience with one or more of the following: Android BSP development and platform integration. Experience working with Qualcomm and/or MediaTek Android platforms. Familiarity with Android platform bring-up, Board Support Packages (BSP), vendor release integration, and platform

The description is cut here. Read the full offer: https://jobsbylevel.com/jobs/lead-software-engineer-build-release-at-logitech-f281ca

Source: https://jobsbylevel.com/jobs/lead-software-engineer-build-release-at-logitech-f281ca

## Cite this page

Level. https://jobsbylevel.com/jobs/lead-software-engineer-build-release-at-logitech-f281ca.

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