# Module Development Engineer at Intel

Intel is hiring a Module Development Engineer. It pays $134k-$189k a year and Level rates it Little AI ●○○○; you can [apply on Intel](https://jobsbylevel.com/go/0a710f82-20a0-47dc-866f-a4b5bbd44b66?utm_medium=ai-agent).

AI Level 1, AI centrality 35 out of 100. US, Oregon, Hillsboro.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 35 out of 100)
- Location: US, Oregon, Hillsboro
- Salary: $134k-$189k
- Posted: November 9, 2026
- Apply: https://jobsbylevel.com/go/0a710f82-20a0-47dc-866f-a4b5bbd44b66?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=module-development-engineer-at-intel-8dbd33

## Description

Job Details: Job Description: The Role and Impact Intel's advanced packaging technology development organization is seeking a Module Development Engineer to support the development of next-generation semiconductor packaging technologies, with a focus on 3D Integrated Circuit (3D IC) technology and advanced manufacturing processes. In this role, you will contribute to the development, evaluation, and optimization of semiconductor manufacturing processes that enable future technology generations. Working closely with engineering and manufacturing teams, you will help develop innovative process solutions, address complex technical challenges, and support the introduction of new technologies into the factory. This position offers the opportunity to work on cutting-edge semiconductor technologies while contributing to Intel's continued leadership in advanced packaging and 3D IC development. Key Responsibilities Develop, evaluate, and optimize semiconductor manufacturing processes supporting next-generation 3D IC and advanced packaging technologies. Support technology development initiatives focused on introducing new processes and manufacturing capabilities for future technology generations. Conduct process characterization, experimental evaluations, and data analysis to identify opportunities for process improvement. Apply statistical process control (SPC), design of experiments (DOE), and engineering analysis techniques to evaluate process performance and support technology development. Troubleshoot manufacturing process and equipment challenges, perform root cause analysis, and implement corrective actions to improve process performance. Collaborate with cross-functional engineering teams to support process integration, equipment development, and manufacturing readiness. Participate in the evaluation, qualification, and optimization of manufacturing equipment and process technologies. Work with engineering and manufacturing teams to identify opportunities for process automation, efficiency improvements, and technical innovation. Document experimental results, technical findings, and process development activities to support engineering decisions and future technology implementation. Contribute to the successful development and transfer of next-generation semiconductor packaging processes. Qualifications: Minimum Qualifications Candidates must possess one of the following: Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related STEM field with 4+ years of of experience in semiconductor manufacturing, process development, or equipment development. OR Master's degree in the same fields with 3+ years of experience in semiconductor manufacturing, process development, or equipment development. OR PhD in the same fields with no prior industry experience required. Additional Technical Requirement 1+ year of combined experience across the following areas: Statistical Process Control (SPC) and/or Design of Experiments (DOE). Semiconductor processing, system controls, or mechanical systems. Preferred Qualifications Experience programming or developing engineering solutions using Python and/or MATLAB. Hands-on experience with robotics, equipment automation, machine vision, or image processing systems. Experience troubleshooting semiconductor manufacturing equipment or processes, including root cause analysis and corrective action implementation. Experience with semiconductor packaging processes, including advanced packaging technologies. Experience with equipment development, automation development, or engineering project management. We welcome your expertise and creativity to join Intel's dynamic team, where you can make a meaningful impact on the future of semiconductor technology. Apply today and take the next step in your career. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional

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