# Oregon Advanced Packaging Module Engineer at Intel

Intel is hiring an Oregon Advanced Packaging Module Engineer. It pays $76k-$146k a year and Level rates it Little AI ●○○○; you can [apply on Intel](https://jobsbylevel.com/go/92d5cd13-9d2d-40fc-b609-31ced5cd74cc?utm_medium=ai-agent).

AI Level 1, AI centrality 35 out of 100. US, Oregon, Hillsboro.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 35 out of 100)
- Location: US, Oregon, Hillsboro
- Salary: $76k-$146k
- Posted: October 27, 2026
- Apply: https://jobsbylevel.com/go/92d5cd13-9d2d-40fc-b609-31ced5cd74cc?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=oregon-advanced-packaging-module-engineer-at-intel-948ff0

## Description

Job Details: Job Description: At Intel, we create world-changing technology that improves the life of every person on the planet. By joining the Oregon Advanced Packaging (ORAP) team—supporting both our Aloha and Ronler factories—you will become part of the Wafer Packaging Manufacturing (WPM) organization. Our mission is to deliver world-class manufacturing solutions through advanced wafer-level processes and packaging technologies, enabling high-volume production, supporting global technology transfer, and driving the innovations that shape the future of computing. We are seeking an Oregon Advanced Packaging Module Engineer to join our advanced manufacturing operations in Hillsboro, Oregon. In this role, you will play a critical part in driving Intel’s advanced semiconductor manufacturing processes. You will own high-volume packaging equipment and processes that enable the miniaturization and mass production of integrated circuits. This position offers an exceptional career path to design process controls, execute continuous improvement initiatives, and work directly on cutting-edge systems that impact Intel's global production roadmap. Key Responsibilities: Equipment & Process Ownership: Manage high-volume manufacturing equipment and processes to support device miniaturization and the production of next-generation integrated circuits. Process Control & Metrology: Conduct technical tests and measurements to maintain critical process control for dimensions and inline defectivity. Excursion Prevention: Develop, implement, and monitor systems for excursion prevention and discrepant material detection within the equipment modules. Technology Transfer: Partner with global Intel manufacturing sites to transfer process qualification outcomes, coordinate training, and align performance metrics. Continuous Improvement: Lead engineering initiatives focused on safety, quality, productivity, cost reduction, and systematic defect reduction. Factory Ramp Management: Coordinate equipment installations, conversions, and qualifications during factory ramps to ensure tooling is brought online safely and on schedule. Supplier Collaboration: Partner directly with equipment and material suppliers to optimize tool configurations and materials for high-volume manufacturing. As a Successful Candidate, You Will Bring: Technical Leadership & Collaboration: Natural leadership skills to guide cross-functional teams, influence global partners, and work effectively across organizational boundaries. Problem-Solving & Innovation: Highly analytical mindset with a passion for diagnosing complex electromechanical and process issues using structured data. Adaptability & Tolerance for Ambiguity: Comfortable operating in a rapidly changing, fast-paced high-volume manufacturing environment. Meticulous Attention to Detail: Commitment to precision, safety, and strict compliance with design-to-target standards. Apply today to join Intel Oregon's Advanced Packaging team. Take ownership of industry-leading technology, drive manufacturing innovation, and grow your career alongside global pioneers. Qualifications: Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience. Minimum Qualifications: An applicant must meet one of the following criteria: A Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related STEM field and 1+ years of hands-on experience in semiconductor manufacturing or high-tech process equipment. OR a Master's degree in a matching STEM discipline. Relevant experience can be any of the following:

The description is cut here. Read the full offer: https://jobsbylevel.com/jobs/oregon-advanced-packaging-module-engineer-at-intel-948ff0

Source: https://jobsbylevel.com/jobs/oregon-advanced-packaging-module-engineer-at-intel-948ff0

## Cite this page

Level. https://jobsbylevel.com/jobs/oregon-advanced-packaging-module-engineer-at-intel-948ff0.

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