# Packaging Module Development Engineer at Intel

AI Level 1, AI centrality 0 out of 100. Malaysia, Kulim.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 0 out of 100)
- Location: Malaysia, Kulim
- Posted: October 7, 2026
- Apply: https://jobsbylevel.com/go/66cdcb91-0616-44f2-af70-be4978e57726

## Description

Job Details: Job Description: Surface Mount Technology Development (SMTD), part of Intel's Assembly Technology Development (ATD) packaging team, cater to Intel's customer product assembly needs and certify Surface Mount Technology (SMT) manufacturing for new Central Processing Unit (CPU), Chipset, System on Chip (SoC) BGA packages, and Socket Technology. The Surface Mount Technology Development Lab in Kulim, Malaysia, offers SMT manufacturing, provides expertise in technology development, enabling next-generation product roadmaps through innovative solutions in circuit board technology, assembly processes, and materials. In this role, you will be a Packaging Module Development Engineer focuses on process, equipment, materials technology development for SMT processes and Printed Circuit Boards (PCBs). Your responsibilities will include developing SMT process solutions and recommendations for Intel's integrated circuit (IC) packages and Sockets, as well as advancing new technologies to support Intel's SMT and PCB roadmap. What you will do: As a Packaging Module Development Engineer, you will be tasked with developing and validating board assembly process solutions to meet Intel's next-generation product requirements. Your responsibilities will include creating SMT process solutions for Intel IC packages and sockets, identifying and addressing root causes of defects in SMT process development, and publishing Critical to Function (CTF) parameter recommendations and manufacturability guidelines for Intel's customers to adopt. You will also be responsible for SMT Process Development. Design and optimize SMT processes, including stencil design, solder paste selection, reflow profiling, and inspection criteria to ensure high yield and reliability. Materials Characterization: Evaluate and select materials such as solder pastes, fluxes, underfills, and adhesives to enhance assembly performance and reliability. Process Integration: Collaborate with cross-functional teams to integrate new SMT processes into existing manufacturing lines, ensuring compatibility and scalability. Influence IC package and PCB design based on a deeper understanding of SMT, and manufacturing processes in internal and external strategic forums. Failure Analysis: Conduct root cause analysis of assembly defects and implement corrective actions to improve process robustness. Technology Roadmap: Contribute to the development of technology roadmaps for SMT and PCB advancements, focusing on miniaturization, higher interconnect densities, and improved thermal and electrical performance. Prototype Testing: Oversee the assembly and testing of prototype boards, utilizing advanced equipment such as X-ray inspection and automated optical inspection (AOI). Data Analysis: Utilize statistical tools and software to analyse process data, identify trends, and drive continuous improvement initiatives. Documentation and Training: Develop detailed process documentation and provide training technicians to ensure consistent implementation of new technologies. Qualifications: Possess a Bachelor's degree with 3+ years of experience or Master's degree with 3+ years of experience or Ph.D. degree with 2+ years of experience in Mechanical Engineering, Materials Science, Chemical Engineering or Physics or related STEM fields. Experiences required are Semiconductor integrated circuit (IC) assembly OR Printed Circuit Board Assembly (PCBA SMT) in process and equipment related such as reflow, pick and place, dispensing of paste, adhesive with good understanding of material interaction with assembly processes or use condition. Proficiency in statistical tools and methods (e.g., SPC, DOE) for process optimization. The candidate should exhibit the following behavioral traits and/or skills: Discipline, Experimenters. Strong written and verbal communication skills, with the ability to collaborate effectively across teams. A proactive approach to problem-solving and the ability to excel under tight

The description is cut here. Read the full offer: https://jobsbylevel.com/jobs/packaging-module-development-engineer-at-intel-1c48cf

Source: https://jobsbylevel.com/jobs/packaging-module-development-engineer-at-intel-1c48cf

## Cite this page

Level. https://jobsbylevel.com/jobs/packaging-module-development-engineer-at-intel-1c48cf.

Get job alerts: https://jobsbylevel.com/newsletter