# Packaging Module Development Engineer at Intel

Intel is hiring a Packaging Module Development Engineer. It pays $156k-$220k a year and Level rates it Little AI ●○○○; you can [apply on Intel](https://jobsbylevel.com/go/2af37f11-584d-4a82-803d-4c9664349f03?utm_medium=ai-agent).

AI Level 1, AI centrality 37 out of 100. US, Oregon, Hillsboro.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 37 out of 100)
- Location: US, Oregon, Hillsboro
- Salary: $156k-$220k
- Posted: October 29, 2026
- Apply: https://jobsbylevel.com/go/2af37f11-584d-4a82-803d-4c9664349f03?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=packaging-module-development-engineer-at-intel-3f520a

## Description

Job Details: Job Description: The Role and Impact As a Module Development Engineer within Intel's Advanced Packaging Technology Development (APTD) Metrology Group, you will contribute to the development, optimization, and implementation of advanced metrology capabilities supporting Intel's next-generation semiconductor packaging technologies. Your work will combine hands-on equipment and process development, equipment qualification, manufacturing process optimization, and technology development initiatives. You will support both existing metrology operations and the evaluation of emerging technologies that enable future manufacturing capabilities. Collaborating with cross-functional teams across process integration, module engineering, advanced process control, automation, and equipment suppliers, you will help improve manufacturing readiness, equipment performance, and process capabilities while contributing to Intel's long-term technology roadmap. About the Group The APTD Metrology Group at Intel supports critical semiconductor technology development programs by enabling advanced measurement and inspection capabilities. As packaging technologies continue to evolve, metrology plays an essential role in process development, yield improvement, and manufacturing readiness. The group works closely with engineering, manufacturing, and technology development teams to introduce innovative measurement solutions and support Intel's next-generation semiconductor technologies. Key Responsibilities Contribute to the development and execution of metrology technology roadmaps by evaluating emerging equipment capabilities, industry trends, and future manufacturing requirements. Participate in technology development and pathfinding initiatives, including feasibility studies, process evaluations, and the introduction of new metrology capabilities. Support the installation, qualification, characterization, and validation of new metrology and inspection equipment to ensure manufacturing readiness. Own and support metrology equipment and manufacturing processes, including equipment troubleshooting, process monitoring, recipe development, and continuous improvement activities. Develop, optimize, and implement manufacturing process improvements to enhance equipment performance, process stability, yield, and operational efficiency. Support metrology module development activities, including recipe optimization, process parameter evaluation, statistical process control (SPC), and sampling strategies. Investigate manufacturing process excursions, perform root cause analysis, and implement corrective actions to improve equipment and process performance. Collaborate with equipment suppliers and cross-functional engineering teams to evaluate new technologies, resolve technical challenges, and support equipment development initiatives. Partner with process integration, manufacturing, automation, and advanced process control teams to implement process improvements and enhance manufacturing capabilities. Provide technical insights, process performance data, and recommendations to support engineering decisions, technology development projects, and manufacturing readiness reviews. Your contributions will help advance Intel's semiconductor manufacturing capabilities while supporting the development of next-generation advanced packaging technologies. Qualifications: Minimum Qualifications Candidates must possess one of the following: Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related STEM field with 6+ years of semiconductor manufacturing experience, including manufacturing process development and application of statistical process control (SPC), data analysis, and/or process improvement methodologies. OR Master's degree in the same fields with 4+ years of semiconductor manufacturing experience, including manufacturing process development and application of statistical

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Source: https://jobsbylevel.com/jobs/packaging-module-development-engineer-at-intel-3f520a

## Cite this page

Level. https://jobsbylevel.com/jobs/packaging-module-development-engineer-at-intel-3f520a.

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