# Packaging Module Development Engineer at Intel

Intel is hiring a Packaging Module Development Engineer in Phoenix, United States. It pays $134k-$189k a year and Level rates it Little AI ●○○○; you can [apply on Intel](https://jobsbylevel.com/go/2b769dd1-1907-4bb5-987f-41515e54a656?utm_medium=ai-agent).

AI Level 1, AI centrality 37 out of 100. US, Arizona, Phoenix.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 37 out of 100)
- Location: US, Arizona, Phoenix
- Salary: $134k-$189k
- Posted: October 23, 2026
- Apply: https://jobsbylevel.com/go/2b769dd1-1907-4bb5-987f-41515e54a656?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=packaging-module-development-engineer-at-intel-3fc182

## Description

Job Details: Job Description: At Intel, we create world-changing technology that improves the life of every person on the planet. This position is part of Intel's Advanced Packaging Technology Manufacturing (APTM) division, which is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, our Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. We are seeking a Packaging Module Development Engineer to join our campus in Chandler, Arizona. In this role, you will contribute to advancing technology and foundry capabilities by developing advanced thermal interface and warpage mitigation solutions. This role sits at the cutting edge of materials science and mechanical engineering, where you will innovate next-generation materials, qualify specialized assembly equipment, and collaborate with global teams to optimize assembly processes for quality, yield, and high-volume manufacturability. Key Responsibilities: Thermal & Warpage Engineering: Develop, qualify, and implement thermal interface and warpage mitigation solutions to support future packaging platforms. Assembly Process Optimization: Partner with cross-functional, matrixed teams to optimize advanced assembly processes for quality, reliability, cost, yield, productivity, and high-volume scalability. Material & Fabrication Innovation: Research and qualify next-generation materials, equipment, and fabrication processes to enhance packaging capabilities at scale. Project Management: Manage engineering project milestones to meet critical technology development and product timelines. Technical Problem Solving: Apply statistical methods, structural judgment, and materials analysis to resolve complex packaging assembly failures. Sustaining & High-Volume Support: Provide sustaining engineering support for equipment performance and process health inside high-volume manufacturing lines. Foundry Customer Engagement: Respond directly to foundry customer technical requests and resolve process integration events promptly. As a Successful Candidate, You Will Bring: Technical Leadership & Strategic Planning: Outstanding critical thinking skills with a natural aptitude for coaching, developing, and leading technical teams. Tolerance for Ambiguity & Adaptability: Excellent flexibility in managing changing priorities, fluctuating timelines, and dynamic environment demands. Collaborative Influencing: Strong interpersonal skills to effectively align priorities across highly matrixed, cross-organizational business units. Initiative & Autonomy: Driven self-starter with the focus to drive complex research initiatives independently. Apply today to join Intel Arizona's Assembly Technology Development team. Partner with global industry leaders, take ownership of advanced thermal and structural breakthroughs, and build a rewarding engineering career. Qualifications: This is an entry level position and will be compensated accordingly. You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience. Minimum Qualifications: A Master’s Degree or a PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, Applied Physics, or a related STEM field. Relevant experience & academic parameters: 1+ years of experience in materials characterization, packaging process development, or mechanical testing (obtained through academic research, coursework, internships, or industry experience). A minimum GPA of 3.5 on a 4.0 scale. At least one publication as a primary or contributing author in a

The description is cut here. Read the full offer: https://jobsbylevel.com/jobs/packaging-module-development-engineer-at-intel-3fc182

Source: https://jobsbylevel.com/jobs/packaging-module-development-engineer-at-intel-3fc182

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