# Packaging Module Development Engineer at Intel

Intel is hiring a Packaging Module Development Engineer in Phoenix, United States. It pays $134k-$189k a year and Level rates it Little AI ●○○○; you can [apply on Intel](https://jobsbylevel.com/go/197e51e4-7cec-490b-a0ec-c0265189831d?utm_medium=ai-agent).

AI Level 1, AI centrality 35 out of 100. US, Arizona, Phoenix.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 35 out of 100)
- Location: US, Arizona, Phoenix
- Salary: $134k-$189k
- Posted: September 16, 2026
- Apply: https://jobsbylevel.com/go/197e51e4-7cec-490b-a0ec-c0265189831d?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=packaging-module-development-engineer-at-intel-86557f

## Description

Job Details: Job Description: Intel is one of the world's most iconic and innovative technology companies, dedicated to designing and manufacturing the foundational semiconductor technologies that power the modern world. From the devices in your pocket to the data centers running the internet, Intel's innovations are everywhere. With a bold vision for the future of computing — spanning artificial intelligence, advanced packaging, and next-generation chip architectures — Intel is transforming what's possible. Our Arizona campuses are among the most advanced semiconductor research, development, and manufacturing facilities on the planet, and they're growing. Join us and be part of something truly world-changing. Are you ready to shape the future of semiconductor technology? We're looking for a talented and driven Packaging Module Development Engineer to join our Advanced Packaging Technology & Manufacturing (APTM) team in Chandler, Arizona . In this role, you'll be at the cutting edge of semiconductor packaging innovation — designing, optimizing, and qualifying the assembly processes and equipment that make Intel's most advanced products possible. You'll work on technologies that power mobile devices, edge computing platforms, and high-performance computing systems used by millions of people around the world. This is your opportunity to make a real, lasting impact on the future of technology. Key Responsibilities Develop, optimize, and qualify packaging assembly processes and equipment to meet world-class quality, reliability, yield, and cost targets. Lead experimental design and process characterization using Design of Experiments (DOE) and Statistical Process Control (SPC) methodologies. Innovate new techniques, materials, and tools to address emerging challenges in packaging quality and reliability. Collaborate with cross-functional teams to identify and mitigate technical risks, ensuring success across product development milestones. Establish and maintain specifications for materials and equipment, partnering with suppliers to meet performance and quality standards. Provide technical consultation and support for packaging challenges in both development and high-volume manufacturing environments. Document technical findings, process improvements, and experimental results in reports, white papers, and qualification documents. Drive standardization in manufacturing systems, equipment setups, and process flows across Intel sites globally. As a successful candidate, you must possess Collaborative Spirit — You thrive in team environments and build strong relationships across disciplines and organizations. Intellectual Curiosity — You love asking "why" and "what if," and you're always looking for better ways to solve problems. Results Orientation — You're driven to deliver, even in the face of ambiguity or complexity. Clear Communicator — You can translate complex technical findings into clear, actionable insights for diverse audiences. Adaptability — You embrace change and can pivot quickly when priorities shift or new challenges emerge. Growth Mindset — You're committed to continuous learning and actively seek out opportunities to develop your skills and knowledge. Ownership Mentality — You take pride in your work and hold yourself accountable for outcomes. If you're excited about the opportunity to work on some of the most advanced semiconductor packaging technologies in the world — and to do it alongside a team of world-class engineers in Intel's state-of-the-art Arizona facilities — we want to hear from you. Qualifications: This is an entry level position and will be compensated accordingly. You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school

The description is cut here. Read the full offer: https://jobsbylevel.com/jobs/packaging-module-development-engineer-at-intel-86557f

Source: https://jobsbylevel.com/jobs/packaging-module-development-engineer-at-intel-86557f

## Cite this page

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