# Packaging Module Development Engineer at Intel

Intel is hiring a Packaging Module Development Engineer in Phoenix, United States. It pays $115k-$220k a year and Level rates it Little AI ●○○○; you can [apply on Intel](https://jobsbylevel.com/go/f8e3cdc5-7de2-495c-8e87-a226b25e15c8?utm_medium=ai-agent).

AI Level 1, AI centrality 34 out of 100. US, Arizona, Phoenix.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 34 out of 100)
- Location: US, Arizona, Phoenix
- Salary: $115k-$220k
- Posted: October 21, 2026
- Apply: https://jobsbylevel.com/go/f8e3cdc5-7de2-495c-8e87-a226b25e15c8?utm_medium=ai-agent

## Description

Job Details: Job Description: At Intel, we create world-changing technology that improves the life of every person on the planet. This position is part of Intel's Advanced Packaging Technology Manufacturing (APTM) organization, which develops and commercializes advanced semiconductor packaging solutions. APTM delivers scalable, data-driven processes and integrated hardware and software tools that support Intel's technology leadership in high-performance computing applications. We are seeking a Packaging Module Development Engineer to join our team in Chandler, Arizona. This unique hybrid position sits at the intersection of metrology engineering, data analytics, and engineering software development. In this role, you will develop and optimize advanced metrology inspection recipes, design bespoke desktop software applications to interface with precision hardware and create automated analysis tools to transform complex equipment data streams into actionable manufacturing insights. Key Responsibilities: Desktop Application Development: Design, code, test, deploy, and maintain lightweight desktop applications and automated engineering scripts using Python frameworks (PyQt, Tkinter) or C#/.NET. Full Software Lifecycle Management: Own the full software development lifecycle, including requirements gathering, architecture, code development, testing, version control, technical documentation, and long-term maintenance. Advanced Metrology Recipe Development: Develop, qualify, and optimize advanced packaging inspection recipes, equipment parameters, and processes to meet yield, quality, and throughput targets. Data Science & Pipeline Engineering: Create robust data pipelines to parse raw equipment outputs, perform statistical analysis on multi-dimensional datasets (sensor logs, image stacks, metrology outputs), and write structured results to SQL databases. Process Control & Hardware Characterization: Execute structured Design of Experiments (DOE), Measurement System Analysis (MSA), and Statistical Process Control (SPC) to isolate hardware variation and define process windows. Systems Troubleshooting: Perform hands-on troubleshooting of software applications, equipment interfaces, communications protocols, drivers, sensors, and metrology subsystems. Supplier & Partner Collaboration: Collaborate with external equipment suppliers and cross-functional engineering teams to resolve technical tool faults, improve system reliability, and implement corrective actions. As a Successful Candidate, You Will Bring: Multi-Disciplinary Problem Solving: A passion for resolving highly complex, unstructured issues at the intersection of physical hardware, software code, and manufacturing data. Collaborative & Technical Leadership: Highly effective at partnering across diverse matrixed teams, global engineering groups, and external technical suppliers. Strong Project Management: Strong organizational skills to drive complex, time-sensitive technical projects with minimal supervision. Proactive & Outcome-Driven: Self-motivated learner who takes pride in building internal tools, improving operational efficiency, and driving high-quality standards. Apply today to join Intel Chandler's Advanced Packaging Technology Manufacturing team. Take ownership of cutting-edge technology, merge your passions for software and hardware, and grow your career alongside global pioneers. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience. Minimum Qualifications: An applicant must meet one of the following educational and experience criteria: A Bachelor’s degree in Engineering, Computer Science,

The description is cut here. Read the full offer: https://jobsbylevel.com/jobs/packaging-module-development-engineer-at-intel-8e7abe

Source: https://jobsbylevel.com/jobs/packaging-module-development-engineer-at-intel-8e7abe

## Cite this page

Level. https://jobsbylevel.com/jobs/packaging-module-development-engineer-at-intel-8e7abe.

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