# Packaging Module Development Engineer at Intel

Intel is hiring a Packaging Module Development Engineer in Phoenix, United States. It pays $115k-$220k a year and Level rates it Little AI ●○○○; you can [apply on Level](https://jobsbylevel.com/go/0a5145fd-a6b4-4c66-b3c5-ff12ee7f4700?utm_medium=ai-agent).

AI Level 1, AI centrality 37 out of 100. US, Arizona, Phoenix.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 37 out of 100)
- Location: US, Arizona, Phoenix
- Salary: $115k-$220k
- Posted: October 15, 2026
- Apply: https://jobsbylevel.com/go/0a5145fd-a6b4-4c66-b3c5-ff12ee7f4700?utm_medium=ai-agent

## Description

Job Details: Job Description: The Advanced Packaging Technology and Manufacturing (APTM) organization is seeking a Metrology Equipment Engineer to drive process control, manufacturing data analytics, and yield improvement for Thermal Compression Bonding (TCB) technologies. The successful candidate develops and sustains metrology systems, measurement methods, and inspection equipment to support Intel’s roadmap for advanced packaging and Thermal Compression Bonding technologies. They apply engineering principles and novel concepts to deliver measurement solutions that improve process control, product quality, reliability, productivity, yield, and manufacturability. What You’ll Do Key responsibilities will include but not limited to: Optimizes metrology capability across laboratory and manufacturing environments by developing and qualifying measurement processes, equipment specifications, calibration methods, and correlation techniques. Uses design of experiments, statistical analysis, and measurement system analysis to improve repeatability, reproducibility, and consistency across tools, sites, and product generations. Documents technical findings and improvements through white papers, reports, and qualification summaries. Establishes measurement specifications and collaborates with equipment suppliers, internal development teams, quality, process, and manufacturing organizations to ensure measurement capability, traceability, and data integrity meet program needs. Provides technical consultation on measurement challenges, equipment issues, lab-to-factory correlation, and metrology process improvements. Supports standardization of metrology methods, and works closely with packaging technology development, process engineering, and partner engineering groups to assess readiness and meet product milestones. ​ Behavioral traits that we are looking for: Strong analytical and problem-solving skills. Ability to lead complex technical initiatives and influence cross-functional teams. Excellent communication and collaboration skills. High ownership, accountability, and execution focus. Passion for innovation and continuous improvement. Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life. See Intel Benefits for more details. Qualifications: You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Note: For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Minimum Qualifications and Experience: Bachelor's degree in Electrical Engineering, Mechanical Engineering, Physics, Metrology, Instrumentation, Optical Engineering, or a related engineering discipline with 4+ years of experience. Or a Master's degree in the same filed with 3+ years of experience or a PhD in the same filed with 1+ years of educational or work experience. Your experience describe above must be in the following: Experience in metrology systems development, measurement equipment qualification, calibration, and/or measurement method development in a manufacturing, lab, or engineering environment. Measurement system analysis (MSA), including bias, linearity, stability, repeatability, and reproducibility. Experience with electrical measurements and test, such as continuity, resistance, leakage, signal integrity basics, or related parametric test methods. Experience with optical metrology, including microscopes, imaging systems, inspection methods, and/or machine vision. Data analysis tools such as Python, Excel, SQL, or similar tools for measurement

The description is cut here. Read the full offer: https://jobsbylevel.com/jobs/packaging-module-development-engineer-at-intel-d604b7

Source: https://jobsbylevel.com/jobs/packaging-module-development-engineer-at-intel-d604b7

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