# Packaging Module Engineering Technician at Intel

Intel is hiring a Packaging Module Engineering Technician in Phoenix, United States. It pays $52k-$100k a year and Level rates it Little AI ●○○○; you can [apply on Intel](https://jobsbylevel.com/go/8262de8d-5c71-4f44-ab65-73974a7d0412?utm_medium=ai-agent).

AI Level 1, AI centrality 37 out of 100. US, Arizona, Phoenix.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 37 out of 100)
- Location: US, Arizona, Phoenix
- Salary: $52k-$100k
- Posted: November 5, 2026
- Apply: https://jobsbylevel.com/go/8262de8d-5c71-4f44-ab65-73974a7d0412?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=packaging-module-engineering-technician-at-intel-62e267

## Description

Job Details: Job Description: Intel Corporation is a global technology pioneer, designing and manufacturing the crucial silicon foundations that power the world’s digital infrastructure. You will join Intel's highly collaborative Advanced Packaging and Assembly team—a critical group focused on driving breakthrough packaging innovations. Our mission is to enhance production efficiency, optimize next-generation assembly processes, and deliver world-class semiconductor packaging solutions to customers globally. We are seeking a detail-oriented and collaborative Packaging Module Engineering Technician to support advanced packaging technology development in Arizona. Operating in a state-of-the-art laboratory environment, this fully on-site role focuses on preparing samples, running analytical testing, and evaluating materials. You will work side-by-side with research engineers to generate high-quality analytical data that directly influences semiconductor process optimization, quality control, and failure analysis. Key Responsibilities: • Perform materials characterization and analysis using microscopy, imaging, acoustic inspection, and other analytical techniques. • Prepare samples and coupons for testing through cross-sectioning, polishing, etching, ion milling, spin coating, and related preparation methods. • Operate characterization and test equipment including SEM/EDS, CSAM/TSAM, optical microscopy, elemental analysis, and mechanical testing systems. • Support material evaluations, process development activities, and failure analysis investigations. • Collect, analyze, document, and communicate characterization results and technical findings. • Maintain laboratory equipment through routine maintenance, calibration, and basic troubleshooting. • Ensure compliance with laboratory safety, quality, and documentation standards. • Collaborate with engineers and cross-functional teams to execute experiments and deliver timely analytical support. • Perform chemical handling, wet processing, and experiments in accordance with laboratory safety protocols and environmental health and safety (EHS) requirements. As a Successful Candidate, You Will Bring: Analytical & Solution-Oriented: A natural curiosity and logical approach to resolving nonstandard process, testing, and equipment issues. Collaborative Communicator: Excellent interpersonal and communication skills to work effectively with cross-functional engineering and research teams. Rigorous Attention to Detail: Outstanding precision, organization, and a steadfast commitment to laboratory quality and safety protocols. Growth Mindset: An eagerness to master new characterization techniques and adapt to innovative semiconductor technologies. Are you ready to accelerate your career at the forefront of semiconductor R&D and packaging innovation? Apply today to join Intel's Advanced Packaging team in Chandler, Arizona! Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience. This Position is not eligible for Intel immigration sponsorship. Minimum Qualifications: An applicant must meet one of the following criteria: An associate degree or a bachelor’s degree in a STEM-related discipline. No prior professional experience is required. OR a High School Diploma (or GED) plus 1+ years in Material characterization, sample preparation, laboratory testing, or failure analysis. Preferred Qualifications: 1+ years of experience or knowledge: Operating analytical and characterization equipment such as SEM/EDS, optical microscopy, or similar tools. Sample preparation techniques including cross-sectioning, polishing, etching, ion milling, water-jet cutting, spin coating, or related

The description is cut here. Read the full offer: https://jobsbylevel.com/jobs/packaging-module-engineering-technician-at-intel-62e267

Source: https://jobsbylevel.com/jobs/packaging-module-engineering-technician-at-intel-62e267

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