# Packaging Module Equipment Development Engineer at Intel

Intel is hiring a Packaging Module Equipment Development Engineer in Phoenix, United States. It pays $134k-$189k a year and Level rates it Little AI ●○○○; you can [apply on Intel](https://jobsbylevel.com/go/90b9f537-f2fa-4803-8c24-d243bc7f6d69?utm_medium=ai-agent).

AI Level 1, AI centrality 35 out of 100. US, Arizona, Phoenix.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 35 out of 100)
- Location: US, Arizona, Phoenix
- Salary: $134k-$189k
- Posted: October 26, 2026
- Apply: https://jobsbylevel.com/go/90b9f537-f2fa-4803-8c24-d243bc7f6d69?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=packaging-module-equipment-development-engineer-at-intel-67b643

## Description

Job Details: Job Description: At Intel, we create world-changing technology that improves the life of every person on the planet. This position is part of Intel's Advanced Packaging Technology Manufacturing (APTM) organization, which is dedicated to advancing and scaling innovative semiconductor packaging solutions. APTM's mission is to deliver state-of-the-art technologies that empower mobile, edge, and high-performance computing applications, while supporting Intel's broader goals of technological leadership and global customer success. We are seeking a Senior Packaging Module Development Engineer to join our team in Chandler, Arizona. In this role, you will play a critical part in developing and optimizing the semiconductor packaging processes and equipment that drive Intel's next-generation roadmap. You will develop advanced assembly processes, design rigorous reliability testing simulations, and drive standardized manufacturing configurations across global Intel factories. This role requires regular onsite presence to collaborate hands-on with cutting-edge equipment, materials, and development tools in our state-of-the-art labs. Key Responsibilities: Process & Equipment Qualification: Develop, optimize, and qualify advanced packaging assembly processes, materials, and hardware configurations to meet yield, reliability, and cost requirements. Equipment Integration: Manage first-time process integration and equipment selection, with a focus on dispense, mold, and/or cure technologies. Reliability Simulation & Testing: Develop and maintain systems to evaluate silicon and packaging technologies under simulated field-use conditions, such as heat, humidity, temperature cycling, and dynamic forces. Statistical Process Control: Lead efforts to design experiments (DOE), apply statistical methods (SPC), and analyze manufacturing data to define process windows and continuously optimize productivity. Supplier & Vendor Management: Establish raw material and tooling specifications, and partner with contract assemblers, material vendors, procurement, and supplier quality teams to ensure vendor performance. Data-Driven Problem Solving: Create new techniques, quality screens, and acceleration methods to ensure the early identification of quality and reliability risks based on failure mechanisms. Factory Standardization: Drive global standardization of product qualifications, manufacturing quality systems, equipment configurations, and process flows across multiple Intel manufacturing sites. Technical Documentation: Author detailed technical reports, process specifications, qualification logs, and technical white papers to support technology transfers. As a Successful Candidate, You Will Bring: Structured Technical Leadership: Strong leadership skills to guide cross-functional teams, influence design partners, and manage complex, time-sensitive technical projects. Strong Strategic Influencing: Exceptional communication and interpersonal skills to consult on packaging improvements and collaborate across diverse matrixed organizations. Analytical Problem Solving: Deep analytical mindset with a passion for diagnosing complex hardware and process-related challenges. Action-Oriented Decision Making: Driven self-starter focused on achieving results, with the agility to adapt to new methods, tools, and fields of study. Apply today to join Intel Arizona's Advanced Packaging team. Take ownership of cutting-edge manufacturing processes, partner with world-class engineers, and build a rewarding technical career. Qualifications: This is an entry level position and will be compensated accordingly. You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work

The description is cut here. Read the full offer: https://jobsbylevel.com/jobs/packaging-module-equipment-development-engineer-at-intel-67b643

Source: https://jobsbylevel.com/jobs/packaging-module-equipment-development-engineer-at-intel-67b643

## Cite this page

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