# Packaging Module Equipment Development Engineer at Intel

Intel is hiring a Packaging Module Equipment Development Engineer in Phoenix, United States. It pays $85k-$140k a year and Level rates it Little AI ●○○○; you can [apply on Intel](https://jobsbylevel.com/go/1855d81a-3c21-4969-ad05-56204bdfb05a?utm_medium=ai-agent).

AI Level 1, AI centrality 0 out of 100. US, Arizona, Phoenix.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 0 out of 100)
- Location: US, Arizona, Phoenix
- Salary: $85k-$140k
- Posted: October 29, 2026
- Apply: https://jobsbylevel.com/go/1855d81a-3c21-4969-ad05-56204bdfb05a?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=packaging-module-equipment-development-engineer-at-intel-f76d57

## Prepare for this job

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## Description

Job Details: Job Description: At Intel, we create world-changing technology that improves the life of every person on the planet. Intel's Packaging Module Development team is dedicated to designing and optimizing cutting-edge assembly and packaging solutions across Intel's diverse product portfolio. Through close collaboration with cross-functional teams, our group drives innovation in manufacturing processes, enhances product reliability, and contributes to Intel's broader mission of delivering world-class semiconductor technologies to global markets. We are seeking a Packaging Module Equipment Development Engineer to join our onsite team in Chandler, Arizona. In this role, you will be at the forefront of advancing Intel's assembly and packaging technologies. You will develop innovative processes and refine equipment to enable next-generation packaging solutions that drive manufacturing efficiency, product reliability, and technological innovation. Working hands-on with advanced tools and materials, your contributions will directly support Intel's technology roadmap and global leadership in the semiconductor industry. Key Responsibilities: Assembly Process & Equipment Development: Develop, optimize, and qualify packaging assembly processes and hardware configurations to meet quality, reliability, cost, yield, productivity, and manufacturability targets. Statistical Process Characterization: Apply Design of Experiments (DOE) and Statistical Process Control (SPC) principles to define process and equipment specifications, documenting improvements through technical reports and white papers. Design-for-Manufacturability (DFM): Verify the manufacturability of physical package layouts and oversee the end-to-end lifecycle of manufactured package processes, procedures, and production flows. Supplier & Material Management: Establish material specifications for contract assemblers and raw material vendors, partnering with supplier quality and procurement teams to enforce strict adherence to process and qualification standards. Early Risk & Quality Screening: Create new acceleration methods, analytical tools, and quality screens to identify and mitigate potential packaging quality and reliability risks early in the development cycle. Reliability Benchmarking: Set reliability requirements based on a fundamental understanding of failure mechanisms, influencing package design, material selection, and process development. Global Standardization & Consultation: Deliver standardization across product qualification methods and manufacturing quality systems, providing technical consultation to internal partner groups and responding to customer requests. As a Successful Candidate, You Will Bring: Analytical Problem Solving: Strong troubleshooting mindset focused on innovating and continuously improving equipment and processes using structured experimental methods. Cross-Functional Collaboration: Clear, direct communication style to consult on packaging challenges and align priorities across technology development, procurement, and external vendor teams. Proactive Project Execution: Self-motivated and organized approach to driving complex, time-critical technical projects from concept through high-volume manufacturing. Adaptability & Ownership: Thrives in a fast-paced, hands-on onsite lab and factory environment, taking full ownership of technical risk mitigation and product milestones. Apply today to join Intel Arizona's Packaging Module Development team. Take ownership of cutting-edge assembly technologies, collaborate with world-class engineers, and build a rewarding career at the forefront of semiconductor innovation. Qualifications: This is an entry level position and will be compensated accordingly. You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant

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