# Packaging Research and Development Engineer at Intel

Intel is hiring a Packaging Research and Development Engineer in Phoenix, United States. It pays $134k-$189k a year and Level rates it Little AI ●○○○; you can [apply on Intel](https://jobsbylevel.com/go/fec7a505-c3a1-4f4b-a91e-6846d8cb829b?utm_medium=ai-agent).

AI Level 1, AI centrality 30 out of 100. US, Arizona, Phoenix.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 30 out of 100)
- Location: US, Arizona, Phoenix
- Salary: $134k-$189k
- Posted: October 22, 2026
- Apply: https://jobsbylevel.com/go/fec7a505-c3a1-4f4b-a91e-6846d8cb829b?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=packaging-research-and-development-engineer-at-intel-932c0c

## Description

Job Details: Job Description: Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and material development to scale advanced substrate packaging technology to enable further die disaggregation / heterogenous integration. This position requires most of time spent on the factory floor and/or interacting with equipment/material suppliers. The candidate will join and become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry. Responsibilities will include but not be limited to: - Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies - Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials interactions - Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity - Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development. The ideal candidate should exhibit the following behavioral traits and/or skills: - Written and verbal communication and teamwork skills. - Interact with equipment and materials suppliers. - Willingness to travel (some travel may be required, less than 5 percent) - Work with ambiguity and flexibility with respect to job roles and working hours is required. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences. Minimum qualifications: The candidate must possess one of the following: Master's degree in a relevant science or engineering discipline, preferably Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or Chemistry , with 3+ years of related experience ; or PhD degree in a relevant science or engineering discipline, preferably Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or Chemistry , with 1+ year of related experience . Experience listed below should be in any of the following: Mechanical & Materials Engineering: Solid background in mechanical and materials engineering, with experience applying materials characterization, mechanical design principles, reliability assessments, and failure analysis to support advanced packaging and manufacturing technology development. Advanced Packaging & Manufacturing Development: Experience developing semiconductor packaging, substrate, embedded die, or heterogeneous integration technologies, including hands-on work with process equipment, factory operations, and equipment suppliers. Process Characterization & Optimization: Expertise in DOE, statistical analysis, process development, root cause investigation, and driving improvements in yield, reliability, quality, and process capability. Preferred qualifications: 1+ years of experience in the following: - Research & Innovation Experience: Experience conducting research in semiconductor packaging, materials, manufacturing processes, or related fields - Engineering troubleshooting and analytical skills on integrated technology issues and experience working with broad team of other process and integration engineers. - Experience owning process tools with knowledge of SPC PCS RFCs equipment troubleshooting statistical design of experiments and process development. - Experience working with a variety of

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Source: https://jobsbylevel.com/jobs/packaging-research-and-development-engineer-at-intel-932c0c

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