# PIC Process Integration Engineer at Nokia

Nokia is hiring a PIC Process Integration Engineer. Level rates it Little AI ●○○○; you can [apply on Nokia](https://jobsbylevel.com/go/09d3bcb1-a86e-4a92-a471-e61742109c93?utm_medium=ai-agent).

AI Level 1, AI centrality 37 out of 100. United States.

## Details

- Company: [Nokia](https://jobsbylevel.com/companies/nokia)
- AI level: AI Level 1 (score 37 out of 100)
- Location: United States
- Posted: November 4, 2026
- Apply: https://jobsbylevel.com/go/09d3bcb1-a86e-4a92-a471-e61742109c93?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=pic-process-integration-engineer-at-nokia-b904db

## Description

The Photonic Integrated Circuit (PIC) group at Nokia is at the forefront of developing and producing the chips that power our terabit-scale digital optical transport networks. We’re looking for a driven and collaborative Process Integration / Fab Start-Up engineer to join our PIC Product Integration Team. We are seeking a highly motivated and technically skilled engineer to lead the bring-up and qualification of a new Indium Phosphide (InP) photonics semiconductor fabrication facility. This role is critical to establishing high-yield, scalable, and reliable photonic device manufacturing processes in a cutting-edge fab environment. The ideal candidate will have experience with InP or compound semiconductor process development, fab tool qualification, and yield improvement. • Fab Bring-Up & Equipment Qualification : Support the start-up and drive the qualification of front-end and back-end process tools for InP-based photonic device fabrication. Work closely with process engineers and other internal stakeholders to meet process and equipment milestones. Process Development & Integration : Develop and optimize process modules (etch, deposition, lithography, diffusion, metallization, etc.) for InP-based PICs (Photonic Integrated Circuits). Ensure process robustness and repeatability across the full device flow. Yield & Reliability Engineering : Establish process monitoring metrics, inline metrology strategies, and SPC to drive yield improvement. Identify root causes of process excursions or device failures; lead corrective actions using FA tools and DOE methodology. Cross-Functional Collaboration : Interface with device design, test, and packaging teams to ensure manufacturability and alignment on performance targets. Documentation & Technology Transfer : Develop and maintain detailed process documentation, FMEA analyses, and qualification reports. Support the transfer of developed processes from R&D to pilot and volume production. BS/MS/PhD in Electrical Engineering, Materials Science, or related field. Hands-on experience in compound semiconductor fabrication, with a strong preference for InP-based photonics. Understanding of semiconductor process integration, yield improvement methodologies, and cleanroom practices. Experience with fab tool bring-up and qualification, including troubleshooting and maintenance support. Strong problem-solving skills, with a data-driven mindset and familiarity with tools like JMP, Python and MES/SPC software packages. Experience with SPC, Design for Manufacturing (DfM), and six-sigma principles for continuous improvement is a plus. Excellent communication and teamwork skills; able to work in a fast-paced startup or ramp-up environment.

Source: https://jobsbylevel.com/jobs/pic-process-integration-engineer-at-nokia-b904db

## Cite this page

Level. https://jobsbylevel.com/jobs/pic-process-integration-engineer-at-nokia-b904db.

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