# Printed Circuit Board (PCB) Layout Engineer at Hewlett Packard Enterprise

Hewlett Packard Enterprise is hiring a Printed Circuit Board (PCB) Layout Engineer. Level rates it Little AI ●○○○; you can [apply on Level](https://jobsbylevel.com/go/bad95bca-1c02-4eb3-a010-00e42d1b71cf?utm_medium=ai-agent).

AI Level 1, AI centrality 28 out of 100. Chippewa Falls, Wisconsin, United States of America.

## Details

- Company: [Hewlett Packard Enterprise](https://jobsbylevel.com/companies/hewlett-packard-enterprise)
- AI level: AI Level 1 (score 28 out of 100)
- Location: Chippewa Falls, Wisconsin, United States of America
- Posted: October 15, 2026
- Apply: https://jobsbylevel.com/go/bad95bca-1c02-4eb3-a010-00e42d1b71cf?utm_medium=ai-agent

## Description

Printed Circuit Board (PCB) Layout Engineer This role has been designed as ‘’Onsite’ with an expectation that you will primarily work from an HPE office. Who We Are: Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE. Job Description: We are seeking an experienced Printed Circuit Board (PCB) Layout Engineer to design complex printed circuit boards (PCBs) for high-performance computing systems. The PCB Design Engineer will work independently to lay out and help release cutting-edge, high-speed PCBs into production. Responsibilities: Design printed circuit board layouts using computer-aided design software, consistent with electrical engineering circuit-performance, signal-integrity, and EMI specifications; mechanical engineering form factor and thermal requirements; and manufacturing requirements. Read and interpret schematics, system functionality and performance specifications, and company PCB design guidelines as necessary to complete printed circuit board layouts. Determine PCB design approaches and parameters. Influence design decisions related to the analysis and resolution of system-performance issues associated with printed circuit board layout. Education and Experience: Associate degree or equivalent technical degree with 10+ years of experience laying out complex, multilayer, high-speed printed circuit boards. Bachelor’s degree in Electrical Engineering or equivalent technical degree with 4+ years of experience laying out complex, multilayer, high-speed printed circuit boards. Advanced knowledge of ECAD software, particularly Cadence Allegro PCB Editor required. Advanced knowledge of PCB design guidelines and design constraints. Experience performing layout studies, determining component placement, and helping drive sound architectural decisions. Experience laying out boards with DDR4 or newer, PCIe Gen 4 or newer, high-speed SerDes, Ethernet, I²C, SPI, and similar interfaces. Experience with high-speed routing techniques, such as microvias, blind and buried vias, and backdrilling. Experience working with PCB fabrication shops and PCA contract manufacturers. Experience with liquid-cooled designs is a plus. Experience helping define ASIC package ball maps is a plus. Experience with industry-standard form factors, such as PCIe CEM and Open Compute Project, is a plus. Experience creating symbols and managing symbol libraries is a plus. Knowledge and Skills: Ability to read and interpret schematics, datasheets, and layout guidelines. Ability to work with—and, when necessary, lead—engagements with design partners, including electrical engineers, mechanical engineers, signal-integrity and power-integrity engineers, and others. Working knowledge of electronics, including signal- and power-integrity issues. Understanding of EMC principles and best practices for mitigating EMI. In-depth knowledge of Design for Manufacturing (DFM) and Design for Test (DFT) principles. Ability to work independently with loosely defined parameters and perform conceptual analysis. Ability to work successfully with engineers across various geographies to meet design requirements and schedules. Ability to manage multiple board designs simultaneously. Excellent written and verbal communication skills. Accessibility HPE is committed to creating an inclusive and accessible workplace and encourages applications from all

The description is cut here. Read the full offer: https://jobsbylevel.com/jobs/printed-circuit-board-pcb-layout-engineer-at-hewlett-packard-enterprise-f1d927

Source: https://jobsbylevel.com/jobs/printed-circuit-board-pcb-layout-engineer-at-hewlett-packard-enterprise-f1d927

## Cite this page

Level. https://jobsbylevel.com/jobs/printed-circuit-board-pcb-layout-engineer-at-hewlett-packard-enterprise-f1d927.

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