# Process Engineer, Gold-To-Gold Interconnect & Flip Chip Assembly (Starlink/Akoustis)   at SpaceX

SpaceX is hiring a Process Engineer, Gold-To-Gold Interconnect & Flip Chip Assembly (Starlink/Akoustis)  . Level rates it Little AI ●○○○; you can [apply on SpaceX](https://jobsbylevel.com/go/d3276b11-e508-4033-93e4-db543c0af7e6?utm_medium=ai-agent).

AI Level 1, AI centrality 33 out of 100. Bastrop, TX.

## Details

- Company: [SpaceX](https://jobsbylevel.com/companies/spacex)
- AI level: AI Level 1 (score 33 out of 100)
- Location: Bastrop, TX
- Posted: November 2, 2026
- Apply: https://jobsbylevel.com/go/d3276b11-e508-4033-93e4-db543c0af7e6?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=process-engineer-gold-to-gold-interconnect-flip-chip-assembly-starlink-akoustis-at-spacex-e3c23d

## Description

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars. PROCESS ENGINEER, GOLD-TO-GOLD INTERCONNECT & FLIP-CHIP ASSEMBLY (STARLINK/AKOUSTIS) Akoustis is now operating as a wholly owned subsidiary of SpaceX providing industry leading RF filters using patented XBAW technology to help drive the mission of making human life multi-planetary, while also connecting the world through Starlink. Our work helps further the impact that Starlink is already making on millions of users around the world, while allowing us to broaden that reach dramatically and continue connecting the unconnected here on earth. We are looking for a hands-on Process Engineer to develop, optimize, qualify, and implement advanced IC assembly processes, with a focus on Gold-to-Gold Interconnect (GGI) and thermosonic flip-chip bonding. You will take processes from early prototype through production ramp, working directly with equipment and with package engineering, design, manufacturing, reliability, materials, and supply-chain partners. RESPONSIBILITIES Develop and qualify GGI and thermosonic flip-chip / die-attach processes, including bond force, temperature, ultrasonic energy, bond time, alignment, parallelism, and tool selection; establish process windows with DOE to control bond integrity, contact resistance, and mechanical strength Develop gold stud bump, gold bump, and gold-to-gold interconnect processes and evaluate bond quality and process capability Develop and optimize vacuum mold lamination and related encapsulation (material selection, vacuum, temperature, pressure, time, and cure); troubleshoot voiding, delamination, die shift, warpage, incomplete fill, and bleed Support related assembly steps as needed: wafer/die handling, placement, plasma/surface cleaning, underfill, reflow, singulation, laser marking, and inspection Select and characterize assembly materials (adhesives, mold compounds, substrates, interconnect materials) for impact on bond strength, adhesion, thermal performance, warpage, and reliability Specify, evaluate, install, and qualify assembly equipment (flip-chip bonders, thermosonic bonders, vacuum laminators, plasma, and inspection tools) with suppliers Run DOEs, capability studies, and SPC on critical parameters; write process specs, work instructions, control plans, FMEAs, and qualification reports Drive NPI from prototype through qualification and production release; perform root-cause analysis and support failure analysis (X-ray, SAM, optical, cross-section, SEM) Correlate process settings to electrical, mechanical, and reliability results; apply DFM and own schedules, risks, and production readiness for assigned technologies BASIC QUALIFICATIONS Bachelor's degree in chemical engineering, materials science, mechanical engineering, or other engineering discipline 2+ years of hands-on semiconductor assembly, IC packaging, or electronics manufacturing experience (Internship or extracurricular experience is applicable) PREFERRED SKILLS AND EXPERIENCE 3+ years of hands-on IC assembly or advanced packaging experience, including direct GGI or similar gold-based interconnect work Hands-on thermosonic flip-chip bonding (force, temperature, ultrasonic power, time, alignment, tooling) and gold stud bumping, gold bumps, or gold-to-gold interfaces Vacuum mold lamination or advanced encapsulation with mold sheets, thermally conductive or epoxy molding compounds, or underfills Understanding of plasma/surface preparation, organic/ceramic/leadframe/wafer-level substrates, warpage, CTE mismatch, thermal-mechanical stress, adhesion, and delamination DOE, SPC, Cp/Cpk, root-cause analysis, FMEA, Six Sigma, and control plans Inspection and metrology (X-ray, SAM, optical microscopy, profilometry, cross-section) and interconnect

The description is cut here. Read the full offer: https://jobsbylevel.com/jobs/process-engineer-gold-to-gold-interconnect-flip-chip-assembly-starlink-akoustis-at-spacex-e3c23d

Source: https://jobsbylevel.com/jobs/process-engineer-gold-to-gold-interconnect-flip-chip-assembly-starlink-akoustis-at-spacex-e3c23d

## Cite this page

Level. https://jobsbylevel.com/jobs/process-engineer-gold-to-gold-interconnect-flip-chip-assembly-starlink-akoustis-at-spacex-e3c23d.

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