# Process Integration & Program Leader, Hybrid Bonding / 3DIC at Intel

Intel is hiring a Process Integration & Program Leader, Hybrid Bonding / 3DIC. It pays $248k-$351k a year and Level rates it Little AI ●○○○; you can [apply on Intel](https://jobsbylevel.com/go/6a25b643-53d4-4511-8931-7ef38d0471a6?utm_medium=ai-agent).

AI Level 1, AI centrality 36 out of 100. US, Oregon, Hillsboro.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 36 out of 100)
- Location: US, Oregon, Hillsboro
- Salary: $248k-$351k
- Posted: November 12, 2026
- Apply: https://jobsbylevel.com/go/6a25b643-53d4-4511-8931-7ef38d0471a6?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=process-integration-program-leader-hybrid-bonding-3dic-at-intel-572a00

## Description

Job Details: Job Description: About the Role Lead the integration and execution of next-generation hybrid bonding and 3DIC technologies, taking complex semiconductor technology from development through qualification, manufacturing ramp, and high-volume production. This is a highly visible technical leadership role responsible for bringing together process development, yield, manufacturing, quality, product engineering, and business teams. You will solve complex integration challenges, drive critical technology decisions, manage execution risk, and ensure successful delivery against performance, yield, reliability, schedule, and customer commitments. Responsibilities Own the process integration strategy and execution for advanced hybrid bonding and 3DIC technologies. Drive cross-module optimization across performance, yield, defectivity, reliability, quality, cost, and manufacturability. Lead resolution of complex process integration and manufacturing challenges. Drive technology maturity from development through qualification, technology transfer, manufacturing ramp, and HVM. Lead integrated execution across Process Development, Module Engineering, Yield, Manufacturing, Quality, Product Engineering, Supply Chain, and business organizations. Establish technical priorities, evaluate tradeoffs, manage risks, and drive cross-functional decisions. Partner with customers and product teams to translate requirements into technology and execution priorities. Communicate technology readiness, risks, and recommendations to senior leadership and customer stakeholders. Drive technical learning and best-known methods across development and manufacturing organizations. Required Skills and Experience Significant semiconductor technology-development experience spanning process integration and manufacturing. Experience leading complex technologies from development through qualification and manufacturing ramp. Strong expertise in process integration, yield improvement, defect reduction, quality, reliability, and manufacturing problem solving. Demonstrated ability to lead large, cross-functional technical programs and drive decisions across organizational boundaries. Experience engaging directly with customers on technical requirements, risks, commitments, and escalations. Preferred Skills and Experience Experience with hybrid bonding, 3DIC, heterogeneous integration, wafer-level packaging, advanced interconnect, or leading-edge semiconductor process technologies. Experience taking advanced semiconductor technologies into high-volume manufacturing. Strong technical judgment and a track record of solving difficult integration, yield, and manufacturing problems. Ability to influence senior technical leaders, customers, and cross-functional stakeholders in a fast-moving development environment. Qualifications: Degree in Engineering, Materials Science, Physics, or related technical field BS with 12+ years of relevant experience; MS with 8+ years; or PhD with 6+ years. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your

The description is cut here. Read the full offer: https://jobsbylevel.com/jobs/process-integration-program-leader-hybrid-bonding-3dic-at-intel-572a00

Source: https://jobsbylevel.com/jobs/process-integration-program-leader-hybrid-bonding-3dic-at-intel-572a00

## Cite this page

Level. https://jobsbylevel.com/jobs/process-integration-program-leader-hybrid-bonding-3dic-at-intel-572a00.

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