# Product Failure Analysis Engineer - SCAN Design for Test at Intel

AI Level 1, AI centrality 10 out of 100. US, Oregon, Hillsboro.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 10 out of 100)
- Location: US, Oregon, Hillsboro
- Salary: $142k-$269k
- Posted: October 6, 2026
- Apply: https://jobsbylevel.com/go/f96594f1-e11c-422f-964d-f5d2e82308ef

## Description

Job Details: Job Description: At Intel, we create world-changing technology that enriches the lives of every person on earth. As a global leader in semiconductor innovation, we design and manufacture the world's most advanced chips — powering everything from personal computers and smartphones to data centers, AI systems, and autonomous vehicles. Our Oregon campus is one of our most important engineering hubs in the world, home to thousands of brilliant engineers who are shaping the future of technology. We believe that diversity of thought, background, and experience makes us stronger — and we're committed to building a workplace where everyone can do their best work. We are seeking an experienced Product Failure Analysis Engineer - SCAN Design for Test who is excited by the opportunity to help enable the success of Intel Foundry's leading-edge 18A technology. The ideal candidate brings 6-12 years of semiconductor experience with deep expertise in DFT, ATPG, scan diagnosis, and post-silicon debug, along with a proven track record of solving complex silicon issues in advanced process technologies. In this role, you will play a critical part in accelerating the ramp and quality of Intel Foundry products by driving root-cause analysis of silicon failures, partnering across design, test, technology development, and manufacturing organizations to quickly identify and resolve product and process issues. Your technical leadership will directly contribute to improving product quality, yield, reliability, and time-to-market for next-generation foundry customers. The successful candidate will have hands-on experience utilizing both logical diagnosis techniques (ATPG, scan diagnosis, fault isolation) and physical failure analysis methodologies (FIB, SEM, TEM, laser-based techniques, or equivalent) to isolate defects and determine corrective actions. Strong collaboration skills are essential, as you will work closely with DFT architects, design engineers, validation teams, process integration engineers, yield engineers, and high-volume manufacturing organizations. Beyond issue resolution, we are looking for an engineer who can help shape the future of failure analysis and silicon debug by developing innovative methodologies, automation frameworks, and diagnostic capabilities that improve debug efficiency and accelerate root-cause identification across Intel Foundry's advanced technology portfolio.. Key Responsibilities: Lead Failure Analysis: Utilize state-of-the-art lab equipment — including FIB tools, probe tools, and automated systems — to isolate microscopic silicon circuit failures and identify root causes with precision and speed. Drive Cross-Functional Collaboration: Partner with test and validation engineers, circuit designers, wafer fabrication process engineers, and high-volume manufacturing teams to resolve quality issues, develop temporary mitigations, and implement permanent remedies. Advance Debug Technologies: Develop new debug tools, methodologies, and technologies that push the boundaries of silicon debug, contributing to breakthrough innovations in semiconductor manufacturing. Ensure Design for Debug: Evaluate and resolve component engineering and physical design issues, ensuring products incorporate the necessary design-for-debug features to enable deep silicon isolation capabilities. Support Continuous Improvement: Provide expert input on failure analysis investigation areas and design process improvements, ensuring products consistently perform to specification. As a Successful Candidate, You Will Bring: A collaborative spirit — you thrive in cross-functional environments and build strong relationships across teams. Intellectual curiosity — you love diving deep into complex problems and aren't satisfied until you've found the root cause. Resilience and adaptability — you stay focused and effective even when working on the most challenging, ambiguous problems. Clear communication — you can translate highly technical

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Source: https://jobsbylevel.com/jobs/product-failure-analysis-engineer-scan-design-for-test-at-intel-088d45

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