# Semiconductor Packaging Process Engineering Lead at Intel

Intel is hiring a Semiconductor Packaging Process Engineering Lead in Phoenix, United States. It pays $156k-$298k a year and Level rates it Little AI ●○○○; you can [apply on Intel](https://jobsbylevel.com/go/751fb04a-11aa-4619-b5c2-b4d3dec9bd85?utm_medium=ai-agent).

AI Level 1, AI centrality 36 out of 100. US, Arizona, Phoenix.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 36 out of 100)
- Location: US, Arizona, Phoenix
- Salary: $156k-$298k
- Posted: November 13, 2026
- Apply: https://jobsbylevel.com/go/751fb04a-11aa-4619-b5c2-b4d3dec9bd85?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=semiconductor-packaging-process-engineering-lead-at-intel-b90df9

## Description

Job Details: Job Description: Intel Corporation is a global leader in the semiconductor industry, engineering the foundational technologies that power modern computing. Within Intel, the Epoxy Mold Module division plays a pivotal role in developing and scaling world-class semiconductor packaging solutions. By advancing next-generation assembly processes and driving operational excellence, our group directly enables Intel’s product roadmap and delivers innovative, high-quality products to customers worldwide. We are seeking a visionary and action-oriented Packaging Module Development Manager to lead our engineering team in Arizona. In this critical leadership role, you will guide a specialized team responsible for advancing semiconductor packaging processes and introducing new equipment within a 24x7 manufacturing environment. Your strategic oversight and mentorship will directly resolve complex technical challenges, elevate manufacturing yield and throughput, and shape the future of Intel's packaging capabilities. Key Responsibilities: Team Leadership & Mentorship: Lead, mentor, and develop a team of engineers across a 24x7 operation, cultivating technical expertise, clear goal alignment, and differentiated execution. Process & Equipment Introduction: Guide the deployment, implementation, and optimization of new packaging equipment and process technologies into the manufacturing environment. Specification Oversight: Direct equipment and process specifications to guarantee strict alignment with operational goals and manufacturing expectations. Cross-Functional Partnership: Manage shift engineering coverage and build strong partnerships across manufacturing, automation, and partner engineering groups. Strategic Roadmap Execution: Formulate long-term strategies that advance manufacturing efficiency, yield, throughput, and overall process manufacturability while championing a quality-first culture. As a Successful Candidate, You Will Bring: Inspirational Leadership: Proven talent for coaching, mentoring, and empowering engineering teams to achieve high-impact results and career growth. Results-Driven Accountability: Strong commitment to clear goal setting, structured performance management, and operational excellence. Strategic Problem Solver: Decisive, analytical mindset suited for navigating complex operational challenges and influencing long-term roadmaps. Collaborative Influencer: Exceptional communication and interpersonal skills to build consensus and drive alignment across diverse, cross-functional stakeholders. Quality-First Mindset: Dedication to high standards, continuous improvement, and proactive risk mitigation in a fast-paced environment. Are you ready to lead a high-performing engineering team and shape the future of semiconductor packaging technology? Apply today to join Intel's Epoxy Mold Module leadership team in Chandler, Arizona! Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience. Minimum Qualifications: Bachelor’s Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, or a related STEM field AND 6+ years of professional experience in engineering or manufacturing, relevant experience OR Master’s Degree in the above fields AND 4+ years of professional experience, relevant experience OR PhD in the above fields AND 2+ years of relevant experience. Relevant experience will be any of the following: Developing, qualification testing, or releasing semiconductor packaging assembly processes Equipment or prior professional ownership of DOE (Design of Experiments), SPC (Statistical Process Control), or JMP/Minitab data modeling to resolve

The description is cut here. Read the full offer: https://jobsbylevel.com/jobs/semiconductor-packaging-process-engineering-lead-at-intel-b90df9

Source: https://jobsbylevel.com/jobs/semiconductor-packaging-process-engineering-lead-at-intel-b90df9

## Cite this page

Level. https://jobsbylevel.com/jobs/semiconductor-packaging-process-engineering-lead-at-intel-b90df9.

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