# Semiconductor Research Engineer at Intel

Intel is hiring a Semiconductor Research Engineer in Phoenix, United States. It pays $142k-$200k a year and Level rates it Little AI ●○○○; you can [apply on Intel](https://jobsbylevel.com/go/e01af936-5ada-4837-8d5b-fd2df8f1145b?utm_medium=ai-agent).

AI Level 1, AI centrality 27 out of 100. US, Arizona, Phoenix.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 27 out of 100)
- Location: US, Arizona, Phoenix
- Salary: $142k-$200k
- Posted: November 5, 2026
- Apply: https://jobsbylevel.com/go/e01af936-5ada-4837-8d5b-fd2df8f1145b?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=semiconductor-research-engineer-at-intel-187a4c

## Description

Job Details: Job Description: As a Semiconductor Research Engineer, you will play a crucial role in advancing Intel's assembly and packaging technologies. You will design, develop, and test innovative devices, interconnects, and packaging solutions, leveraging device physics, electromagnetics, and materials science. Your hands-on work will include prototyping and research to optimize performance, reliability, and cost, directly impacting Intel's technological leadership in semiconductor innovation. Business Group Intel Corporation's Assembly Materials Characterization Lab, in Core Competency of Advanced Design and Customer Enabling is dedicated to enabling next-generation semiconductor technologies. This group combines cutting-edge research and development to deliver next generation metrology solution for advanced packaging solutions that drive miniaturization, performance enhancements, and functionality. As part of this dynamic team, you will contribute to Intel's mission to enhance technological capabilities and maintain industry leadership. Key Responsibilities Conduct research using device physics, optics, electromagnetics, and thermomechanical analysis to enable novel devices and packaging technologies. Design and fabricate metrology prototypes to validate groundbreaking concepts for semiconductor assembly and interconnect solutions. Develop testing methodologies for component and device characterization, including dimension, optical signal loss, and stressing. Plan and execute experiments with cross-functional teams to benchmark results against industry standards. Model and analyze trade-offs between design, performance, and reliability to ensure optimal solutions. Collaborate with external vendors and researchers to support Intel's research pipeline. Behavioral traits: Lead and influence technical teams to achieve milestones. Analytical and problem-solving abilities to address unique engineering challenges. Excellent organizational and communication skills, with experience presenting findings and mentoring team members. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Minimum Qualifications Master's in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field with 4+ years of experience- OR- PhD degree with 2+ years of experience. Experience mentioned above should be in the following areas: Research, including optical test metrology, Dimensional metrology, and packaging design methodologies. Programming skills in Python or MATLAB for engineering applications. Experimental setups and data analysis techniques for lab testing. Preferred Qualifications Experience with advanced Co-Packaged Optics (CPO). Experience with advanced packaging technologies like EMIB and Foveros architectures. Expertise in Design of Experiments (DOE), statistical analysis methods, and model-based problem-solving techniques. Familiarity with materials characterization techniques and cross-disciplinary collaboration. Join a team that thrives on innovation, collaboration, and excellence. Be part of shaping the future of semiconductor technology with Intel-apply today. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks

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Source: https://jobsbylevel.com/jobs/semiconductor-research-engineer-at-intel-187a4c

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