# •	Senior Packaging Module Development Engineer at Intel

Intel is hiring a •	Senior Packaging Module Development Engineer in Phoenix, United States. It pays $134k-$255k a year and Level rates it Little AI ●○○○; you can [apply on Intel](https://jobsbylevel.com/go/d720fbd6-ec20-416c-b06e-be8155e14942?utm_medium=ai-agent).

AI Level 1, AI centrality 26 out of 100. US, Arizona, Phoenix.

## Details

- Company: [Intel](https://jobsbylevel.com/companies/intel)
- AI level: AI Level 1 (score 26 out of 100)
- Location: US, Arizona, Phoenix
- Salary: $134k-$255k
- Posted: November 11, 2026
- Apply: https://jobsbylevel.com/go/d720fbd6-ec20-416c-b06e-be8155e14942?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=senior-packaging-module-development-engineer-at-intel-d0c8b3

## Description

Job Details: Job Description: At Intel, we create world-changing technology that improves the life of every person on the planet. Join Intel's Substrate Packaging Technology Development (SPTD) organization, a global leader in developing advanced substrate and packaging solutions. Our team is dedicated to enabling Intel's roadmap of innovative packaging technologies, focusing on materials development, process optimization and simulation, and process equipment advancements. SPTD supports Intel's mission of delivering high-performance, cost-effective products that power the future of computing. We are seeking a Senior Packaging Module Development Engineer to join our team in Chandler, Arizona. In this role, you will play a key part in advancing Intel's IC substrate and packaging technologies. You will develop, optimize, and implement innovative processes, materials, and equipment configurations to enable next-generation packaging solutions. Combining physical experimentation with statistical data analytics and process modeling, your work will directly impact manufacturing efficiency, product quality, and reliability across Intel's advanced packaging portfolio. Key Responsibilities: Process & Material Optimization: Develop and refine packaging processes and materials to meet stringent quality, reliability, yield, and cost targets. Workflow & Equipment Definition: Define and establish equipment configurations, process parameters, and integrated workflows for advanced IC substrate and packaging technologies. Experimental Characterization (DOE): Design and execute experimental plans using Design of Experiments (DOE) principles to characterize process windows and analyze complex material and equipment interactions. Data Analytics & Process Modeling: Apply statistical methods, deep data analytics, and engineering scripting tools to optimize manufacturing processes, drive material enhancements, and resolve IC substrate development challenges. Continuous Improvement: Implement continuous process improvements to enhance tool stability, product quality, and manufacturing productivity. Cross-Functional Problem Solving: Partner with cross-functional engineering, materials, and equipment teams to drive process development and root-cause troubleshooting initiatives. Technical Documentation & Transfer: Author technical documentation, including white papers and process specifications, to enable seamless technology transfer and knowledge sharing across global teams. As a Successful Candidate, You Will Bring: Technical Leadership & Influence: Strong leadership skills to guide cross-functional engineering efforts and drive technical alignment across diverse teams. Analytical Problem Solving: Deep analytical mindset with a passion for combining empirical data and theoretical modeling to solve complex materials and processing challenges. Clear Technical Communication: Concise written and verbal communication style to author specifications, publish internal white papers, and present findings to stakeholders. Adaptability & Ownership: Self-directed engineer who thrives in a dynamic R&D environment and takes full accountability for project milestones. Apply today to join Intel Arizona's Substrate Packaging Technology Development team. Take ownership of next-generation materials and processes, collaborate with world-class scientists, and build a rewarding engineering career. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience. Minimum Qualifications: Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Polymer Engineering, or a related field, with 6+ years of related experience; OR Master's degree

The description is cut here. Read the full offer: https://jobsbylevel.com/jobs/senior-packaging-module-development-engineer-at-intel-d0c8b3

Source: https://jobsbylevel.com/jobs/senior-packaging-module-development-engineer-at-intel-d0c8b3

## Cite this page

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