# Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs  at Amazon

Amazon is hiring a Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs  in Austin, United States. It pays $185k-$250k a year and Level rates it Builds AI ●●●●; you can [apply on Level](https://jobsbylevel.com/go/0dc7d934-1fab-48a3-8aee-dd67cab29110).

AI Level 4, AI centrality 85 out of 100. US, TX, Austin.

## Details

- Company: [Amazon](https://jobsbylevel.com/companies/amazon)
- AI level: AI Level 4 (score 85 out of 100)
- Location: US, TX, Austin
- Salary: $185k-$250k
- Posted: September 29, 2026
- Apply: https://jobsbylevel.com/go/0dc7d934-1fab-48a3-8aee-dd67cab29110

## Description

As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas. You’ll have high standards for yourself and everyone you work with, and you’ll be constantly looking for ways to improve your products performance, quality and cost. We’re changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today. Key job responsibilities As a Sr. Thermal & Mechanical Packaging Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design including thermal and mechanical solutions and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the hardware that goes into our cutting-edge data centers affecting millions of AWS users. Basic qualifications - Experience communicating with customers, technical, regulatory, business teams, and management to collect requirements, describe product features, and technical designs - Master's degree in mechanical engineering or equivalent - 5+ years industry experience in advanced packaging of semiconductors. - Direct experience in designing and testing of test vehicles to assess future packaging architectures and evaluating properties of next-generation materials. - Expertise in optimizing in packaging architectures to meet quality, performance, and cost goals. - 10+ years industry experience in mechanical design of semiconductor-based systems – silicon, packaging, and system design. - Industry experience of working with packaging component vendors and ODMs, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization. - Proficiency with simulation tools such as ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK or equivalent FEA/CFD software Preferred qualifications - Experience in advanced packaging metrologies for characterization, and design validation of semiconductor components, packages, and platforms. Hands-on experience with lab-based thermal and mechanical measurements, including instrumentation, infrared thermography, acoustic chambers, mechanical stress/strain gauges, power measurement equipment, and thermal test setups for package and system-level characterization. - Strong understanding of product development lifecycles from concept through high volume manufacturing - Experience with various types of technologies used for Heatsink solutions, Thermal Interface Materials (TIMs) and liquid cooling technologies - including cold plate design. Working knowledge on fans, UQDs, manifolds, and CDUs. - Developed detailed CFD and compact RC models for SoC and Package thermal analysis. Experience correlating simulation models with experimental data and iterating designs based on empirical findings. - Demonstrated ability to design, set up, and execute experiments in a lab environment, including building custom test fixtures, operating data acquisition systems, and performing root-cause failure analysis on hardware. Experience with Design of Experiments (DOE) and Six Sigma methodologies. - Knowledge of hardware and software based thermal / power management control algorithms - Validated thermal models through power/thermal measurements on Hardware Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status. Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to

The description is cut here. Read the full offer: https://jobsbylevel.com/jobs/sr-thermal-mechanical-packaging-engineer-annapurna-labs-at-amazon-a71f43

Source: https://jobsbylevel.com/jobs/sr-thermal-mechanical-packaging-engineer-annapurna-labs-at-amazon-a71f43

## Cite this page

Level. https://jobsbylevel.com/jobs/sr-thermal-mechanical-packaging-engineer-annapurna-labs-at-amazon-a71f43.

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