# Staff Process Engineer – Thin Film & Metal Deposition at Nokia

Nokia is hiring a Staff Process Engineer – Thin Film & Metal Deposition. Level rates it Little AI ●○○○; you can [apply on Nokia](https://jobsbylevel.com/go/1eabdcad-35ac-43b4-8fb6-38105ebc9512?utm_medium=ai-agent).

AI Level 1, AI centrality 21 out of 100. United States.

## Details

- Company: [Nokia](https://jobsbylevel.com/companies/nokia)
- AI level: AI Level 1 (score 21 out of 100)
- Location: United States
- Posted: October 21, 2026
- Apply: https://jobsbylevel.com/go/1eabdcad-35ac-43b4-8fb6-38105ebc9512?utm_medium=ai-agent
- Free CV review for this job: https://jobsbylevel.com/cv-review?job=staff-process-engineer-thin-film-metal-deposition-at-nokia-4dfa16

## Description

At Nokia Optical Networks , advanced photonic technologies become scalable products powering the world's communication infrastructure. Our team develops and manufactures cutting-edge Indium Phosphide (InP) Photonic Integrated Circuits (PICs) that enable coherent optics, high-speed transceivers, tunable lasers, optical amplifiers, and next-generation networking solutions. As a Staff Process Engineer – Thin Film & Metal Deposition , you will lead the development, optimization, qualification, and sustainment of deposition processes critical to advanced photonic device manufacturing. You will work hands-on with deposition equipment, chamber hardware, materials, and metrology systems while collaborating with device, integration, lithography, etch, reliability, and manufacturing teams to develop robust, manufacturable process solutions. The successful candidate will demonstrate strong technical leadership, a high degree of ownership, enthusiasm for manufacturing excellence, and the ability to provide fast, effective support for a 24x7 production operation. Develop, qualify, and sustain thin film and metallization processes supporting InP photonic integrated circuit manufacturing. Own and optimize deposition processes including PECVD, PVD sputtering, evaporation, electroplating, and other vacuum-based deposition technologies. Support deposition of dielectric and metallic optical and electrical functional films. Lead development and optimization of electrochemical deposition processes, including plating chemistry control, bath maintenance, current density optimization, deposition rate control, thickness uniformity, stress management, and defect reduction Optimize critical process metrics including film thickness, within-wafer uniformity, refractive index, stress, adhesion, sheet resistance, contact resistance, composition, and defectivity. Develop robust metallization processes for lasers, modulators, SOAs, photodiodes, RF structures, and passive optical components. Drive defect reduction, yield improvement, and process capability enhancement using DOE, SPC, advanced analytics, and statistical process control methodologies. Perform root-cause analysis and implement corrective actions for process excursions, film quality issues, equipment failures, and integration-related challenges. Analyze processes from a first-principles, physics-based approach to understand and manipulate mechanisms, not just recipes Collaborate closely with lithography, wet etch, dry etch, device engineering, integration, reliability, and manufacturing teams to optimize overall process performance. Lead evaluations of new materials, process technologies, deposition hardware, and equipment upgrades. Partner with equipment vendors and material suppliers on chamber matching, hardware improvements, reliability enhancements, and cost-of-ownership initiatives. Support technology transfer from development into production while maintaining process stability and manufacturability. Provide rapid response and technical leadership during process excursions and production-impacting events. Support a 24x7 manufacturing environment through issue escalation, troubleshooting, and on-call support when required. Utilize AI-enabled engineering tools, automation, and advanced data analytics to improve process development efficiency and manufacturing performance. M.S. or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Chemistry, or a related technical discipline. B.S. degree with 5+ years of semiconductor, photonics, or advanced manufacturing experience will also be considered. Strong experience in thin film deposition, metallization, and related semiconductor fabrication processes. Experience with semiconductor process development, integration, yield improvement, and production support. Working knowledge of vacuum systems, deposition equipment, process control methodologies, and materials characterization techniques. Demonstrated experience using

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Source: https://jobsbylevel.com/jobs/staff-process-engineer-thin-film-metal-deposition-at-nokia-4dfa16

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Level. https://jobsbylevel.com/jobs/staff-process-engineer-thin-film-metal-deposition-at-nokia-4dfa16.

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