IntelPosted 3w ago

EMIB-T Substrate Program Integrator

EMIB-T Substrate Program Integrator at Intel scores 0 out of 100 on AI centrality, which makes it AI Level 1 of 4 (Little AI) on this board. The level measures how much of the work is AI, not seniority.

US, Arizona, PhoenixseniorFull time$89k-$171k

AI in this role

Lead EMIB-T substrate technology development and supplier qualification activities for advanced semiconductor packaging.

semftiredxspc

advanced-packagingsubstrate-manufacturingprogram-managementsupplier-management

Job Details:

Job Description:

The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology Integration Group, you will play a critical role in enabling advanced packaging technology developments.
In this position, you will lead EMIB-T substrate technology development and qualification activities, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams, suppliers, and assembly platform partners

Qualifications:

Minimum Qualifications

Bachelor's degree with 6+ years of experience, OR Master's degree with 4+ years of experience, OR PhD with 2+ years of experience in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field.

Experience listed above should be in the following:

Experience managing complex projects and deliver results in TD/high-volume manufacturing environments.

Preferred Qualifications

A strong foundation in advanced packaging, substrates, or semiconductor manufacturing; proven leadership in supplier management or technology enablement; and the ability to drive alignment and execution across global teams.
Proven ability to thrive in high-ambiguity environments and deliver results under pressure. Knowledge of advanced packaging technologies and substrate/assembly manufacturing methodologies.
Familiarity with characterization techniques such as X-ray, SEM, FTIR, and EDX.
Experience with process flow development, FMEA, DOE design, and problem-solving tools.
Statistical tools and methods, including Statistical Process Control (SPC) for yield improvement

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $89,010.00-170,630.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Prepare for this job

A free preview built only from this posting: what it asks for, what you could be asked in an interview, and how to adjust your resume.

Skills and AI tools this role asks for

Advanced PackagingSubstrate ManufacturingProgram ManagementSupplier ManagementSemFtirEdxSpc

Questions you could be asked

Tell me about a project where advanced packaging was part of your work. What did you do?
Tell me about a project where substrate manufacturing was part of your work. What did you do?
Tell me about a project where program management was part of your work. What did you do?
Tell me about a project where supplier management was part of your work. What did you do?
Walk me through how you've used Sem in your day-to-day work.

Adapt your resume

List these exact terms on your resume: Advanced Packaging, Substrate Manufacturing, Program Management, Supplier Management, and Sem. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them — a tool named with nothing behind it rarely survives a human read.

Want your resume actually rewritten for this job?

The free preview above is everything we have today. A full resume rewrite is not live yet and has no price set. Join the waitlist and we will email you if we open it.