Packaging Module Development Engineer

Intel is hiring a Packaging Module Development Engineer. Level rates it ; you can apply on Level.

AI in this role

Develop and validate board assembly process solutions for Intel's next-generation semiconductor packages.

surface-mount-technologyprocess-integrationfailure-analysis

Job Details:

Job Description:

Surface Mount Technology Development (SMTD), part of Intel's Assembly Technology Development (ATD) packaging team, cater to Intel's customer product assembly needs and certify Surface Mount Technology (SMT) manufacturing for new Central Processing Unit (CPU), Chipset, System on Chip (SoC) BGA packages, and Socket Technology. The Surface Mount Technology Development Lab in Kulim, Malaysia, offers SMT manufacturing, provides expertise in technology development, enabling next-generation product roadmaps through innovative solutions in circuit board technology, assembly processes, and materials.

In this role, you will be a Packaging Module Development Engineer focuses on process, equipment, materials technology development for SMT processes and Printed Circuit Boards (PCBs). Your responsibilities will include developing SMT process solutions and recommendations for Intel's integrated circuit (IC) packages and Sockets, as well as advancing new technologies to support Intel's SMT and PCB roadmap.

What you will do:

As a Packaging Module Development Engineer, you will be tasked with developing and validating board assembly process solutions to meet Intel's next-generation product requirements.

Your responsibilities will include creating SMT process solutions for Intel IC packages and sockets, identifying and addressing root causes of defects in SMT process development, and publishing Critical to Function (CTF) parameter recommendations and manufacturability guidelines for Intel's customers to adopt.

You will also be responsible for SMT Process Development. Design and optimize SMT processes, including stencil design, solder paste selection, reflow profiling, and inspection criteria to ensure high yield and reliability.

Materials Characterization: Evaluate and select materials such as solder pastes, fluxes, underfills, and adhesives to enhance assembly performance and reliability.
Process Integration: Collaborate with cross-functional teams to integrate new SMT processes into existing manufacturing lines, ensuring compatibility and scalability. Influence IC package and PCB design based on a deeper understanding of SMT, and manufacturing processes in internal and external strategic forums.
Failure Analysis: Conduct root cause analysis of assembly defects and implement corrective actions to improve process robustness.
Technology Roadmap: Contribute to the development of technology roadmaps for SMT and PCB advancements, focusing on miniaturization, higher interconnect densities, and improved thermal and electrical performance.
Prototype Testing: Oversee the assembly and testing of prototype boards, utilizing advanced equipment such as X-ray inspection and automated optical inspection (AOI).
Data Analysis: Utilize statistical tools and software to analyse process data, identify trends, and drive continuous improvement initiatives.
Documentation and Training: Develop detailed process documentation and provide training technicians to ensure consistent implementation of new technologies.

Qualifications:

Possess a Bachelor's degree with 3+ years of experience or Master's degree with 3+ years of experience or Ph.D. degree with 2+ years of experience in Mechanical Engineering, Materials Science, Chemical Engineering or Physics or related STEM fields.
Experiences required are Semiconductor integrated circuit (IC) assembly OR Printed Circuit Board Assembly (PCBA SMT) in process and equipment related such as reflow, pick and place, dispensing of paste, adhesive with good understanding of material interaction with assembly processes or use condition.
Proficiency in statistical tools and methods (e.g., SPC, DOE) for process optimization.

The candidate should exhibit the following behavioral traits and/or skills:

Discipline, Experimenters.
Strong written and verbal communication skills, with the ability to collaborate effectively across teams.
A proactive approach to problem-solving and the ability to excel under tight timelines and schedules.

We invite you to become part of a dynamic team that values innovation, collaboration, and the pursuit of excellence. Your expertise will drive transformative advancements in technology, ensuring Intel continues to lead in delivering exceptional products that shape the future of the semiconductor industry.

Job Type:

Experienced Hire

Shift:

Shift 1 (Malaysia)

Primary Location:

Malaysia, Kulim

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Packaging Module Development Engineer at Intel rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Open the description and count.

Key facts

Packaging Module Development Engineer is an open job at Intel.
Level rates this role AI Level 1 of 4: Little AI.
The role is based in Malaysia, Kulim.
The job was posted on October 7, 2026.
Seniority: mid.
Applications are handled by Intel. Apply on Intel

Prepare for this job

A free preview built only from this posting: what it asks for, what you could be asked in an interview, and how to adjust your resume.

Skills and AI tools this role asks for

Surface Mount TechnologyProcess IntegrationFailure Analysis

Questions you could be asked

Tell me about a project where surface mount technology was part of your work. What did you do?
Tell me about a project where process integration was part of your work. What did you do?
Tell me about a project where failure analysis was part of your work. What did you do?

Adapt your resume

List these exact terms on your resume: Surface Mount Technology, Process Integration, and Failure Analysis. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them — a tool named with nothing behind it rarely survives a human read.

Want an expert to read your CV for this job?

Free. Send your CV and the role you want next. We reply by email within 2 to 4 business days.

Get a free CV review