Product Engineer - Wafer Test

Job Description:

The Product Engineer will focus on the development, validation, and optimization of wafer-level optical and electrical test processes and ensure world-class yield, reliability and performance for transitioning Cisco's next-generation Photonic Integrated Circuits (PICs) from design to high-volume production to power our 400G/800G/1.2T coherent modules.

Key Essential Functions:

1.       Define and implement wafer-level test plans for PIC wafers, including active and passive optical components.

2.       Analyze large-scale wafer test datasets to identify performance trends and yield detractors. Drive root-cause analysis for yield excursions.

3.       Lead Failure Analysis Reports (FAR) for wafer-level rejects. Coordinate with the foundry, design and process teams to resolve failures caused by wafer-level anomalies.

4.       Partner with contract manufacturers to deploy alternative test solutions that reduce lead times and increase throughput without compromising quality.

5.       New Product Introduction (NPI): Drive the "DEV" to "PROD" release states by validating test correlation between bench-top characterization and automated wafer probers.

6.       Cross-Functional Collaboration: Work closely with PIC Design, DSP Firmware, and Hardware teams to define Guard band and spec limits that ensure robust field performance.

Minimum Qualifications, Experience, Skills, Education and Certifications:

1.       Education: BS/MS in Electrical Engineering, Optical Physics, Physics, or Semiconductor Manufacturing.

2.       3+ years of experience in optical or semiconductor industries, focusing on wafer level probe test.

3.       Good understanding of PIC wafer testing on various optical components, including lasers, modulators, detectors and waveguides.

4.       Solid experience with wafer-probing equipment, automated test equipment (ATE), and cleanroom protocols.

5.       Proficiency in statistical analysis software (JMP, Minitab) and database management (SQL/SQLite).

6.       Ability to distill complex technical failures into concise executive summaries and Supplier Corrective Action Requests (SCARs).

7.       Extensive experience managing high-volume manufacturing in Asia (Thailand/Malaysia).

Primary Work Location: Pathum Thani, Thailand

Some Travel Required

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