Level

AmazonPosted 2d ago

Senior IC Package mechanical and thermal design engineer

Senior IC Package mechanical and thermal design engineer at Amazon scores 0 out of 100 on AI centrality, which makes it AI Level 1 of 4 (Little AI) on this board. The level measures how much of the work is AI, not seniority.

IL, Haifaseniorfull-time

AI in this role

Lead mechanical and thermal design, simulation, and packaging for custom semiconductor integrated circuits at Annapurna Labs.

thermal-designmechanical-simulationic-packaginghardware-testing
Annapurna Labs is a semiconductor company established by semiconductor industry veterans and is now part of Amazon Web Services (AWS).
We are developing leading edge products, manufactured on leading edge technologies.
We offer a dynamic, open, teamwork environment operating at high pace mode.

Key job responsibilities
– Assume full ownership of mechanical and thermal design of Annapurna ICs.
– Engage with product architect and design teams on future products package and assembly needs
– Perform package level thermal simulations.
– Perform package level mechanical simulations.
– Lead and design thermal and mechanical measurements of ICs.
– Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurna’s products.
– Engage with substrate and assembly vendors on future technologies roadmap.
– In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
– Ensure testability of the ICs in collaboration with Test Engineer team.


About the team
Diverse Experiences
AWS values diverse experiences. Even if you do not meet all of the qualifications and skills listed in the job description, we encourage candidates to apply. If your career is just starting, hasn’t followed a traditional path, or includes alternative experiences, don’t let it stop you from applying.
Why AWS?
Amazon Web Services (AWS) is the world’s most comprehensive and broadly adopted cloud platform. We pioneered cloud computing and never stopped innovating — that’s why customers from the most successful startups to Global 500 companies trust our robust suite of products and services to power their businesses.
Inclusive Team Culture
AWS values curiosity and connection. Our employee-led and company-sponsored affinity groups promote inclusion and empower our people to take pride in what makes us unique. Our inclusion events foster stronger, more collaborative teams. Our continual innovation is fueled by the bold ideas, fresh perspectives, and passionate voices our teams bring to everything we do.
Mentorship & Career Growth
We’re continuously raising our performance bar as we strive to become Earth’s Best Employer. That’s why you’ll find endless knowledge-sharing, mentorship and other career-advancing resources here to help you develop into a better-rounded professional.
Work/Life Balance
We value work-life harmony. Achieving success at work should never come at the expense of sacrifices at home, which is why flexible work hours and arrangements are part of our culture. When we feel supported in the workplace and at home, there’s nothing we can’t achieve in the cloud.

Basic qualifications

- Bachelor's degree in Electrical Engineering or a related field
- Master's degree in Mechanical or Electrical Engineering or a related field

Preferred qualifications

- Knowledge of SoC architecture
- Experience with microelectronic packaging

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.

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Skills and AI tools this role asks for

Thermal DesignMechanical SimulationIc PackagingHardware Testing

Questions you could be asked

  1. Tell me about a project where thermal design was part of your work. What did you do?
  2. Tell me about a project where mechanical simulation was part of your work. What did you do?
  3. Tell me about a project where ic packaging was part of your work. What did you do?
  4. Tell me about a project where hardware testing was part of your work. What did you do?

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  • List these exact terms on your resume: Thermal Design, Mechanical Simulation, Ic Packaging, and Hardware Testing. An applicant tracking system matches the wording, not the idea.
  • Attach one line of real, concrete experience to at least one of them — a tool named with nothing behind it rarely survives a human read.

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