3D Integration & Advanced Packaging Expert

ASML is hiring a 3D Integration & Advanced Packaging Expert. Level rates it ; you can apply on ASML.

Level's read on this job

On Level's scale, this role is Little AI ●○○○: aI is not part of the work.
Tools and skills the posting cites include advanced packaging, 3d ic and process integration.
Level classifies it as a senior role.
Level lists 818 other open roles at ASML.

AI in this role

Build and maintain technical expertise in Advanced Packaging and 3D Integration technologies to drive product readiness.

advanced-packaging3d-icprocess-integrationsemiconductor-manufacturing

Key deliverable

Build and maintain ASML expertise in Advanced Packaging and 3D Integration technologies.
Accelerate ASML 3D product readiness with understanding customer’s tool usability, automation and operational challenges
Enhance the team's expertise in Advanced Packaging and strengthen its capabilities to support 3D technologies and applications.
Define customer-driven technical requirements, performance targets and use cases, and translate them into ASML product roadmap and development priorities.

Key Activities

Provide deep expertise in Advanced Packaging, 3D IC, and Hybrid Bonding technologies
Review and feedback system design and requirements w.r.t. customer product requirements
Support product strategy, business development, and roadmap planning
Define and lead customer validation plans to demonstrate customer value and support business growth.
Knowledge sharing of Advanced packaging & 3D integration process

Key qualifications

> 5 years process (integration) engineer experience in advanced packaging
Bachelor or Master degree in technical subject with substantial experience or equivalent working and thinking level. Optional Business Administration or commercial education. Experience in technical engineering, preferably in the semiconductor industry.
Strong understanding of semiconductor manufacturing process flows, 3D Integration technologies, and interactions between process modules.
Broad understanding of Advanced Packaging technology trends, customer roadmaps and industry developments.
Ability to translate customer technology challenges and application requirements into product development priorities and business value
Broad understanding of Advanced Packaging process integration and end-to-end process flows across multiple process modules.
Proactive behavior and Logical thinking to solve complex problem or situation.
Strong communication and presentation skills in English, with the ability to engage effectively with customers and cross-functional stakeholders
Good relationship and network with peers, customers and partners

This position requires access to controlled technology, as defined in the United States Export Administration Regulations (15 C.F.R. § 730, et seq.). Qualified candidates must be legally authorized to access such controlled technology prior to beginning work. Business demands may require ASML to proceed with candidates who are immediately eligible to access controlled technology.

Inclusion and diversity

ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that inclusion and diversity is a driving force in the success of our company.

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How we rate this

3D Integration & Advanced Packaging Expert at ASML rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Key facts

3D Integration & Advanced Packaging Expert is an open job at ASML.
Level rates this role AI Level 1 of 4: Little AI.
The role is based in Hwasung, Korea.
The job was posted on September 29, 2026.
Seniority: senior.
Applications are handled by ASML. Apply on ASML

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Advanced Packaging3d IcProcess IntegrationSemiconductor Manufacturing

Questions you could be asked

Tell me about a project where advanced packaging was part of your work. What did you do?
Tell me about a project where 3d ic was part of your work. What did you do?
Tell me about a project where process integration was part of your work. What did you do?
Tell me about a project where semiconductor manufacturing was part of your work. What did you do?

Adapt your resume

List these exact terms on your resume: Advanced Packaging, 3d Ic, Process Integration, and Semiconductor Manufacturing. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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