Advanced Packaging TD Plating Module Engineer

Intel is hiring an Advanced Packaging TD Plating Module Engineer. It pays $134k-$255k a year and Level rates it ; you can apply on Level.

AI in this role

Job Details:

Job Description:

The Role and Impact
As a Module Development Engineer, you will play an integral role in advancing Intel's semiconductor manufacturing capabilities. Your day-to-day responsibilities will focus on developing and optimizing advanced manufacturing processes, performing feasibility studies, and enabling high-volume manufacturing solutions for next-generation device architectures. By driving process innovation and collaborating across teams, your work will directly impact Intel's ability to deliver cutting-edge products and maintain its leadership in the semiconductor industry.

Business group
You will be part of Intel's Advanced Packaging Technology Development organization, a pioneering team that focuses on creating robust and scalable manufacturing processes to support Intel's innovation in semiconductor technology. This group is instrumental in enabling high-volume production while driving advancements in device performance and reliability, helping Intel achieve its broader goals of technological excellence and industry leadership.

Key Responsibilities

Develop and optimize advanced manufacturing processes, including material selection, equipment metrology, and system design.
Conduct feasibility studies and simulations to meet device performance and reliability specifications.
Drive process innovation and pathfinding activities to enable next-generation semiconductor architectures.
Collaborate with equipment and material suppliers to design and implement innovative process technologies.
Develop technology roadmaps to guide future manufacturing needs and set industry standards.
Monitor production efficiency and recommend modifications to improve scalability and output.
Utilize statistical process control and data analytics to ensure process stability and continuous improvement.
Partner with cross-functional teams to align on process integration and project deliverables.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications

Master's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or related STEM field with 4+ years of relevant experience.
OR PhD in the same fields with 2+ years of relevant experience.
2+ years of experience in semiconductor processing or advanced packaging technology development and process development methodologies, statistical process control or manufacturing process improvements.

Preferred Qualifications

Strong technical expertise in areas such as plasma etch, plating processes, or thin-film deposition.
Experience in wafer-level assembly, hybrid bonded interconnects, or advanced packaging technologies.
Demonstrated success in leading programs from strategy formation to high-volume production.
Strong collaboration skills with cross-functional teams, including yield, operations, and supplier management.
Ability to solve complex engineering challenges and drive innovative solutions that align with Intel's strategic goals.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Advanced Packaging TD Plating Module Engineer at Intel rates 31 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.