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Amazon

ASIC III - AMZ27336.4

Amazon is hiring an ASIC III - AMZ27336.4 in Austin, United States. It pays $203k-$215k a year and Level rates it ; you can apply on Amazon.

Level's read on this job

  • On Level's scale, this role is Builds AI ●●●●: the job is building AI systems.
  • Tools and skills the posting cites include soc, ddr and hbm.
  • Level classifies it as a senior role.
  • Level lists 20,000+ other open roles at Amazon.

AI in this role

Engage in definition, design, and validation of AWS next-generation machine learning chips and custom hardware platforms.

socddrhbmsilicon-designasicip-integration
Employer: Annapurna Labs (U.S.) Inc.
Position: ASIC III - AMZ27336.4
Location: Austin, TX

Multiple Positions Available:

Engage in definition, design and validation of AWS next generation ML Chips, Cards and server integration. • Participate in the design and execution of all HBM, Memories and Serdes topics, with the goal of creating and customized platforms that fit within AWS datacenter’s world leading technology. • Work with vendors, understand the settings, write/modify tests, debug and collect data in the fleet • Participate in the code review process, design discussions, team planning, and ticket/metric/COE reviews • Collaborate with architects, design teams, software engineers to deliver the next generation ML chip. • Responsible for IP integration, 2.5D design, bring up, Characterization and validation. • Focus on operational excellence, constructively identifying problems and proposing solutions.

(40 hours / week, 8:00am-5:00pm, Salary Range $202779 - $215300)

Amazon.com is an Equal Opportunity – Affirmative Action Employer – Minority / Female / Disability / Veteran / Gender Identity / Sexual Orientation

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Basic qualifications

A Master’s degree or foreign equivalent in Computer Science, Computer Engineering, Electronics Engineering, or a related field and 5 years of experience in the job offered or a related
occupation. In the alternative, a Bachelor’s degree or foreign equivalent in Computer Science, Computer Engineering, Electronics Engineering or a related field followed by 7 years of
progressively responsible post-baccalaureate experience in the job offered or a related occupation.
Must have 3 years of experience in the following:
1) SOC/IO/Subsystems.
2) DDR/HBM at the PHY and controller level and DDR/HBM training, timing parameters and/or controller features.
3) Driving the IP Integration and designing silicon and 2.5D packaging.
4) Supporting the physical design team, reviewing clocking and timing constraints
5) Driving cross-functional triage effort on complex functional and performance issues.
6) Taking the leadership role in post-silicon bring-up of IO and HBM/DRRx stack.
7) Defining boot-up initialization, reset flow, training sequence.
8) Performing system-level debug and root-cause analysis through bringup, characterization, validation and production phase.
9) Working with 3rd party IP and memory vendors

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Preferred qualifications

All applicants must meet all the above listed requirements.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.

How we rate this

ASIC III - AMZ27336.4 at Amazon rates 85 out of 100 for how much of the daily work is AI. That makes it Builds AI (AI Level 4 of 4). The level is about AI in the job, not seniority.

Classification

Builds AI. The job is building AI systems.

  1. ●●●● Builds AI80 to 100
  2. ●●●○ Works on AI60 to 79
  3. ●●○○ Uses AI40 to 59
  4. ●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

SocDdrHbmSilicon DesignAsicIp Integration

Questions you could be asked

  1. Tell me about a project where soc was part of your work. What did you do?
  2. Tell me about a project where ddr was part of your work. What did you do?
  3. Tell me about a project where hbm was part of your work. What did you do?
  4. Tell me about a project where silicon design was part of your work. What did you do?
  5. Tell me about a project where asic was part of your work. What did you do?

Adapt your resume

  • List these exact terms on your resume: Soc, Ddr, Hbm, Silicon Design, and Asic. An applicant tracking system matches the wording, not the idea.
  • Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.
  • Lead with what you built, trained or shipped. This role is judged on the AI system itself, not the tools around it.

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