Die Prep Module Engineer (Contract)

Intel is hiring a Die Prep Module Engineer (Contract). Level rates it ; you can apply on Intel.

Level's read on this job

On Level's scale, this role is Little AI ●○○○: aI is not part of the work.
Intel has 805 other open roles on Level.
Posted in the last few days.

AI in this role

Job Details:

Job Description:

The Role and Impact As a Die Prep Module Engineer specializing in Advanced Metrology, you will own the performance, capability, and reliability of critical metrology and inspection tools in Intel's manufacturing environment. You will drive equipment optimization, troubleshooting, and technology deployment to improve measurement accuracy, process control, and operational efficiency. Working closely with Process Engineering, Manufacturing, Automation, and suppliers, you will solve complex technical challenges and enable high-volume manufacturing success. Your work will directly support product quality, factory productivity, and Intel's advanced packaging roadmap. Business Group As part of Intel's Wafer Packaging Manufacturing (WPM) organization, you will join a team focused on advancing semiconductor packaging technologies and manufacturing excellence. The Die Prep Module Engineering team develops and sustains metrology and inspection solutions that enable process control, product quality, and efficient manufacturing. In this collaborative environment, you will work with cross-functional teams to deploy new technologies, improve equipment performance, and support factory operations and future technology ramps. Key Responsibilities • Own the performance, reliability, and capability of advanced metrology and inspection equipment within the Die Prep module. • Drive equipment troubleshooting, root cause analysis, and resolution of hardware, software, and automation-related issues. • Improve tool uptime, productivity, and reliability through preventive maintenance and continuous improvement initiatives. • Utilize SPC, DOE, FMEA, and data analysis to identify trends, improve measurement capability, and prevent process excursions. • Partner with Process Engineering, Manufacturing, Automation, and suppliers to support technology transfers, NPI, and manufacturing ramps. • Develop and optimize metrology recipes to meet process control and manufacturing requirements. • Lead equipment installation, qualification, upgrades, and capacity expansion projects. • Develop and maintain operating procedures, maintenance standards, and troubleshooting documentation. • Identify and implement innovative metrology and automation solutions to improve yield, quality, and factory performance.

Qualifications:

Minimum Qualifications • Bachelor's degree in Electrical, Electronics, Mechanical, Mechatronics, Materials Engineering, or a related field. • Knowledge of semiconductor manufacturing processes, preferably in Die Prep, metrology, or advanced packaging. • Experience with statistical and problem-solving methodologies such as SPC, DOE, and FMEA. • Strong troubleshooting and analytical skills with the ability to diagnose equipment and process issues using data-driven approaches. Preferred Qualifications • Experience supporting metrology, inspection, or semiconductor manufacturing equipment in a high-volume production environment. • Demonstrated success in equipment performance improvement, process optimization, or yield enhancement initiatives. • Knowledge of Root Cause Analysis (RCA), process control, and manufacturing data analytics. • Strong communication and collaboration skills with the ability to work effectively across cross-functional teams and external suppliers. • Self-motivated with a passion for innovation, continuous improvement, and manufacturing excellence. We are seeking motivated engineers who are passionate about solving complex technical challenges and driving manufacturing innovation. Join Intel's Die Prep Module Engineering team and play a key role in advancing next-generation packaging technologies, enabling operational excellence, and shaping the future of semiconductor manufacturing.

Job Type:

Intel Contract Employee

Shift:

Shift 1 (Malaysia)

Primary Location:

Malaysia, Kulim

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Die Prep Module Engineer (Contract) at Intel rates 31 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.