Die Prep Module Engineer (Contract Role)

Intel is hiring a Die Prep Module Engineer (Contract Role). Level rates it ; you can apply on Intel.

Level's read on this job

On Level's scale, this role is Little AI ●○○○: aI is not part of the work.
Tools and skills the posting cites include Spc, Doe and Fmea.
Level classifies it as a mid-level role.
Level lists 790 other open roles at Intel.

AI in this role

Process and Equipment Engineer responsible for optimizing high-precision assembly equipment and yield in a semiconductor packaging environment.

spcdoefmea

process-optimizationequipment-engineeringyield-analysistroubleshootingsemiconductor-manufacturing

Job Details:

Job Description:

The Role and Impact
As a Process and Equipment Engineer specializing in Pick and Place, PnP technology, you will be the technical owner driving the performance, capability, and stability of high-precision assembly equipment within our advanced Die Preparation factory. In this role, you will leverage your deep technical expertise to address complex electro-mechanical challenges, optimize high-speed pick and place processes, and implement innovative solutions in a dynamic, high-volume manufacturing environment.

Your hands-on contributions will directly impact factory yield, equipment uptime, OEE, and process stability, playing a vital role in enabling Intel's packaging roadmap and supporting the delivery of next-generation, cutting-edge silicon technologies.

Business group
As part of Intel Wafer Packaging Manufacturing group, you will join a globally recognized organization at the forefront of semiconductor packaging. We design, develop, and deliver innovative factory solutions to meet evolving technology needs. With a commitment to driving advancements in high-density modular assembly, computing, and connectivity, our group fosters a highly collaborative and innovation-driven environment to enable Intel's success in its core business areas.

Key Responsibilities

Process Optimization - Own, stabilize, and optimize pick and place, PnP process parameters, drive systematic yield improvement, and resolve process integration issues.
Equipment Engineering - Lead complex troubleshooting, preventive/corrective maintenance strategies, and collaborate with tool vendors to upgrade hardware/software.
Data and Yield Analysis - Utilize Statistical Process Control, SPC, Design of Experiments, DOE, and Failure Mode and Effects Analysis, FMEA to identify root causes of process drift or hardware failures.
Cross-Functional Collaboration - Partner with upstream/downstream process owners and research and development teams to seamlessly transfer and ramp new products, NPI.
Documentation and Standards - Standardize operating procedures - SOPs, document troubleshooting guides, and present technical findings/progress updates directly to factory stakeholders.

Qualifications:

Bachelor/Master Degree in Electrical / Electronics / Mechanical/ Mechatronics and Materials Engineering with minimum 2 years of work experience.
Fresh graduate is welcome to apply.
Good knowledge experience in semiconductor back-end assembly, specifically within Die Preparation and pick and place, PnP processes will be an added advantage.
Basic understanding of Statistical Process Control, SPC, statistical data analysis, and structured problem-solving methodologies. Expertise in Design of Experiments, DOE, Failure Mode and Effects Analysis, FMEA, and Root Cause Analysis, RCA will be an added advantage.
Good communication skills with the ability to collaborate in cross-functional team environments and present technical data clearly.

Job Type:

Intel Contract Employee

Shift:

Shift 1 (Malaysia)

Primary Location:

Malaysia, Kulim

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Die Prep Module Engineer (Contract Role) at Intel rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Key facts

Die Prep Module Engineer (Contract Role) is an open job at Intel.
Level rates this role AI Level 1 of 4: Little AI.
The role is based in Malaysia, Kulim.
The job was posted on September 3, 2026.
Seniority: mid.
Applications are handled by Intel. Apply on Intel

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Process OptimizationEquipment EngineeringYield AnalysisTroubleshootingSemiconductor ManufacturingSpcDoeFmea

Questions you could be asked

Tell me about a project where process optimization was part of your work. What did you do?
Tell me about a project where equipment engineering was part of your work. What did you do?
Tell me about a project where yield analysis was part of your work. What did you do?
Tell me about a project where troubleshooting was part of your work. What did you do?
Tell me about a project where semiconductor manufacturing was part of your work. What did you do?

Adapt your resume

List these exact terms on your resume: Process Optimization, Equipment Engineering, Yield Analysis, Troubleshooting, and Semiconductor Manufacturing. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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