IC Packaging Engineer
NVIDIA is hiring an IC Packaging Engineer. Level rates it ; you can apply on NVIDIA.
Level's read on this job
- Little AI ●○○○ is how Level rates this role: aI is not part of the work.
- The posting mentions ic packaging, microelectronics and asic among its tools and skills.
- Level classes it as a mid-level role.
- NVIDIA has 2,600+ other open roles on Level.
AI in this role
Lead microelectronics packaging development and reliability analysis for NVIDIA's networking and accelerated computing products.
NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world.
Are you ready to take your engineering career to the next level? NVIDIA, a world-class technology company, is seeking a passionate Package Engineer to join our team in Israel. In this role, you will have the opportunity to collaborate with several design and program teams in the development of sophisticated IC substrates for our groundbreaking products. At NVIDIA, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.
What you will be doing:
Leading development of cutting-edge microelectronics packaging of NVIDIA Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance.
Review manufacturability readiness at each milestone.
Work with world leading vendors to develop highly challenging packaging solutions.
Leading the development of groundbreaking microelectronics packaging for NVIDIA Networking Business Unit's future products
Collaborating with world-leading vendors to develop highly ambitious packaging solutions
Thriving in a dynamic and challenging environment
Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.
Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards.
Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain.
What we need to see:
BSc or equivalent Mechanical/Material Engineering degree, or any related equivalent experience.
2+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing.
Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications.
Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools.
High awareness for quality, robustness, and manufacturability.
High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach.
Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations.
Curious and creative problem solver, well organized and multi-tasker.
Ways to stand out of the crowd:
Hands-on FEA mechanical simulation experience - Advantage
Team / Group / Project management - Advantage
Experience with manufacturing environment and manufacturing statistics tools
Background in engineering semiconductor manufacturing processes
Join us at NVIDIA, an equal-opportunity employer that values diversity and inclusion. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status. We are dedicated to providing reasonable accommodations and adjustments to applicants with disabilities throughout the recruitment process. If you require accommodations, please let us know, and we will work with you to meet your needs.
Apply now to be part of our world-class team and contribute to the future of computing! Widely considered to be one of the technology world’s most desirable employers, NVIDIA offers highly competitive salaries and a comprehensive benefits package. As you plan your future, see what we can offer to you and your family www.nvidiabenefits.com
How we rate this
IC Packaging Engineer at NVIDIA rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.
Little AI. AI is not part of the work.
- ●●●● Builds AI80 to 100
- ●●●○ Works on AI60 to 79
- ●●○○ Uses AI40 to 59
- ●○○○ Little AI0 to 39
Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.
Prepare for this job
Built from this posting and from similar jobs on Level.
Skills and AI tools this role asks for
Questions you could be asked
- Tell me about a project where ic packaging was part of your work. What did you do?
- Tell me about a project where microelectronics was part of your work. What did you do?
- Tell me about a project where asic was part of your work. What did you do?
- Tell me about a project where reliability engineering was part of your work. What did you do?
- Tell me about a project where failure analysis was part of your work. What did you do?
Adapt your resume
- List these exact terms on your resume: Ic Packaging, Microelectronics, Asic, Reliability Engineering, and Failure Analysis. An applicant tracking system matches the wording, not the idea.
- Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.
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