Junior SI/PI and Packaging Engineer

Amazon is hiring a Junior SI/PI and Packaging Engineer in Haifa, Israel. Level rates it ; you can apply on Amazon.

Level's read on this job

On Level's scale, this role is Little AI ●○○○: aI is not part of the work.
Level classifies it as a junior role.
Level lists 20,000+ other open roles at Amazon.
The role was posted in the last few days.

AI in this role

The SIP (Signal-Integrity & Packaging) team is part of Annapurna Labs’ Chip development team. The team is dealing with the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
The team’s work includes close work with the BackEnd team on integrating these interfaces to the Die, the package layout design of the BGA’s substrate, Signal and power integrity simulations, and working with the system team to come up with optimal pin-out and optimal PCB breakout schemes.
We are looking for highly motivated Electrical Engineering graduates, or engineers with up to 3 years’ experience in related fields, to join our growing team specializing in Signal Integrity and IC Package Design. The position offers a unique entry point into a diverse and multidisciplinary domain.

Key job responsibilities
As a SIP engineer, you will be involved in:
● Work on advanced high-speed interfaces such as PCIe, DDR and Ethernet.
● End-to-end solution of high-speed interfaces; from floor-planning at the DIE level, through Package and PCB routing, addressing both robust SI/PI considerations as well as optimizing layout routing.
● Signal and power integrity modeling and simulation of high-speed interconnects using advanced SI/PI simulation tools.

Basic qualifications

- BSc in Electrical Engineering or in related field
- 1-3 years of experience in board design, or lab measurement of digital high-speed interfaces or layout or physical design.
- Familiarity with Signal and Power integrity simulation tools.

Preferred qualifications

- Experience with high-speed digital interfaces such as DRAM/PCIe/SerDes.
- Previous experience with lab equipment (e.g oscilloscope, spectrum analyzer)
- Experience with simulation/extraction tools (e.g. HFSS, Sigrity, HSpice)

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How we rate this

Junior SI/PI and Packaging Engineer at Amazon rates 36 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.