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HP

Mechanical Architect

HP is hiring a Mechanical Architect. It pays $105k-$159k a year and Level rates it ; you can apply on HP.

Level's read on this job

  • Level rates this role Little AI ●○○○: aI is not part of the work.
  • Tools and skills the posting cites include Creo, mechanical engineering and system integration.
  • Level classifies it as a senior role.
  • Level lists 889 other open roles at HP.
  • The role was posted within the past week.

AI in this role

Leads mechanical and hardware systems design for next-generation consumer electronics and AR/VR products.

creo
mechanical-engineeringsystem-integrationdfm-dfafea
Mechanical Architect

Description -

This role is for a highly experienced and innovative Mechanical and Hardware Systems Architect who will lead the design and development of advanced mechanical solutions for next-generation products and platforms. The role provides technical leadership across multiple project teams, collaborates closely with internal and external partners, and drives strategic initiatives in mechanical architecture, component design, system integration, and technology innovation.

Responsibilities

  • Lead cross-functional teams through all phases of mechanical development, including concept design, validation, tooling, and testing.
  • Foster and manage strategic relationships with internal stakeholders and outsourced development partners to ensure high-quality mechanical design execution.
  • Review and assess design outputs and project deliverables for compliance with engineering standards and best practices, providing actionable feedback to enhance product quality.
  • Drive technical decision-making and serve as a subject matter expert in material, manufacturing methods, DFM/DFA, mechanical analysis and system integration
  • Champion the adoption of emerging technologies and innovative design methodologies within the mechanical engineering domain.
  • Define and drive the strategy for key mechanical components such as touch interfaces, keyboards, and connectors.
  • Evaluate vendors and manufacturing processes; participate in supplier development.
  • Contribute to long-term product strategy and R&D efforts
  • Mentor and guide junior engineers, fostering a culture of technical excellence and continuous improvement.


Education & Experience Recommended

  • Bachelor’s or master’s degree in mechanical engineering.
  • 8–12 years of experience in mechanical design, preferably in notebook, Tablet, mobility, or AR/VR product, or other consumer electronics development.
  • Proficiency in 3D CAD tools such as Creo or equivalent.
  • Experience with FEA structural simulations
  • Experience with mechanical architecture and structural design, including material science, hardware integration, and their associated design constraints in electronic system structures.
  • Strong analytical and problem-solving skills with a deep understanding of mechanical architecture in electronic systems.
  • Familiarity with design for manufacturability and a range of manufacturing processes (machining, injection molding, die casting, sheet metal)
  • Exceptional communication skills with the ability to articulate complex design concepts and influence senior leadership.


Knowledge & Skills
• 3D Modeling
• Ansys Simulation Software
• Computer-Aided Design
• Electromechanics
• Engineering Design Process
• Finite Element Methods
• Injection Molding
• Machining
• Manufacturing Processes
• Mechanical Design
• Mechanical Engineering
• Mechanical Systems
• New Product Development
• Product Design
• Product Lifecycle Management
• Prototyping
• PTC Creo (CAD Suite)
• Sheet Metal

Cross-Org Skills
• Effective Communication
• Results Orientation
• Learning Agility
• Digital Fluency
• Customer Centricity

Impact & Scope
• Impacts function and leads and/or provides expertise to functional project teams and may participate in cross-functional initiatives.

Complexity
• Works on complex problems where analysis of situations or data requires an in-depth evaluation of multiple factors.

Disclaimer
• This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.


The pay range for this role is $105,050 to $159,000 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

Benefits:

HP offers a comprehensive benefits package for this position, including:

  • Health insurance
  • Dental insurance
  • Vision insurance
  • Long term/short term disability insurance
  • Employee assistance program
  • Flexible spending account
  • Life insurance
  • Generous time off policies, including;
  • 4-12 weeks fully paid parental leave based on tenure
  • 11 paid holidays
  • Additional flexible paid vacation and sick leave (US benefits overview)


The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -

Relocation -

Equal Opportunity Employer (EEO) - 

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"

How we rate this

Mechanical Architect at HP rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

  1. ●●●● Builds AI80 to 100
  2. ●●●○ Works on AI60 to 79
  3. ●●○○ Uses AI40 to 59
  4. ●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Mechanical EngineeringSystem IntegrationDfm DfaFEACreo

Questions you could be asked

  1. Tell me about a project where mechanical engineering was part of your work. What did you do?
  2. Tell me about a project where system integration was part of your work. What did you do?
  3. Tell me about a project where dfm dfa was part of your work. What did you do?
  4. Tell me about a project where fea was part of your work. What did you do?
  5. Walk me through how you've used Creo in your day-to-day work.

Adapt your resume

  • List these exact terms on your resume: Mechanical Engineering, System Integration, Dfm Dfa, FEA, and Creo. An applicant tracking system matches the wording, not the idea.
  • Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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