Level

Hewlett Packard Enterprise

Mechanical Engineer, Thermal & Packaging

Hewlett Packard Enterprise is hiring a Mechanical Engineer, Thermal & Packaging in Bengaluru, India. Level rates it ; you can apply on Hewlett Packard Enterprise.

Level's read on this job

  • Little AI ●○○○ is how Level rates this role: aI is not part of the work.
  • Tools and skills the posting cites include Creo, CAD and Cfd.
  • Level classifies it as a mid-level role.
  • Level lists 1,600+ other open roles at Hewlett Packard Enterprise.
  • The role was posted within the past week.

AI in this role

Design and validate mechanical and thermal hardware, electronic enclosures, and production tooling using CFD and CAD.

creocadcfd
mechanical-engineeringthermal-designelectronics-packagingsimulation
Mechanical Engineer, Thermal & Packaging

  

This role has been designed as ‘’Onsite’ with an expectation that you will primarily work from an HPE office.

Who We Are:

Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE.

Job Description:

   

What You Will Do:


  • Design, analyze, develop, modify, and evaluate mechanical and thermal hardware, electronic enclosures, and production tooling.
  • Develop and implement test plans for new and existing designs, including tolerance analysis, form-fit-function, shock and vibration, EMI, safety, reliability, acoustics, fan curves, and system power measurements.
  • Conduct feasibility studies, design margin analysis, validation, and empirical testing.
  • Use CFD analysis and thermal mockups to validate thermal solutions.
  • Collaborate with management, internal teams, and external development partners on design status, project progress, and issue resolution.
  • Lead mechanical engineering project teams to deliver reliable, cost-effective, and high-quality solutions.
  • Represent the mechanical and thermal engineering team throughout complex product development projects.
  • Provide technical guidance and mentoring to junior engineers.

What You Need to Bring:

  • Bachelor's or Master's degree in Mechanical Engineering.
  • Typically 4–6 years of relevant mechanical engineering experience.
  • Proficiency in ProEngineer (ProE/Creo) or other 3D CAD software.
  • Strong understanding of electronics packaging and mechanical hardware design.
  • Experience designing sheet metal and plastic components, including production tooling and manufacturing processes.
  • Knowledge of CFD, thermal simulation, and thermal mockups for thermal validation.
  • Strong analytical, problem-solving, and design validation skills.
  • Excellent written and verbal communication skills in English and the local language.
  • Ability to communicate product architectures and design proposals, negotiate technical options with management, and coordinate cross-functional teams.

Accessibility


HPE is committed to creating an inclusive and accessible workplace and encourages applications from all qualified individuals, including those with disabilities. If you believe you require accommodation during any stage of the application or interview process, please submit your request by completing our secure form linked here.


Note: This option is reserved for applicants needing assistance/reasonable accommodation related to a disability.

What We Can Offer You:

Health & Wellbeing

We strive to provide our team members and their loved ones with a comprehensive suite of benefits that supports their physical, financial and emotional wellbeing.

Personal & Professional Development

We also invest in your career because the better you are, the better we all are. We have specific programs catered to helping you reach any career goals you have — whether you want to become a knowledge expert in your field or apply your skills to another division.

Unconditional Inclusion

We are unconditionally inclusive in the way we work and celebrate individual uniqueness. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good.

Let's Stay Connected:

Follow @HPECareers on Instagram to see the latest on people, culture and tech at HPE.

#india

#networking

Job:

Engineering

Job Level:

TCP_03

    

    

HPE is an Equal Employment Opportunity/ Veterans/Disabled/LGBT employer. We do not discriminate on the basis of race, gender, or any other protected category, and all decisions we make are made on the basis of qualifications, merit, and business need. Our goal is to be one global team that is representative of our customers, in an inclusive environment where we can continue to innovate and grow together. Please click here: Equal Employment Opportunity.

Hewlett Packard Enterprise is EEO Protected Veteran/ Individual with Disabilities.

   

HPE will comply with all applicable laws related to employer use of arrest and conviction records, including laws requiring employers to consider for employment qualified applicants with criminal histories.

   

Recruitment Fraud Alert

We have become aware of an increase in fraudulent recruitment activities in which individuals impersonate our company or authorized recruitment agencies to offer fake employment opportunities. These scams may occur through false websites, emails, social media, or chat-based applications and often aim to obtain personal information or money. Please note that Hewlett Packard Enterprise (HPE), its direct and indirect subsidiaries and affiliated companies, and its authorized recruitment agencies/vendors will never charge a candidate a registration fee, hiring fee, or any other fee in connection with its recruitment and hiring process. We also never request personal information such as back account details, Social Security numbers, or national IDs via social media or chat applications.

All legitimate job opportunities will come through official company channels, and candidates are responsible for verifying the credentials of any third party claiming to represent the company. Any reliance on fraudulent communication is at the individual’s own risk, and HPE disclaims legal liability for any resulting damages. If you suspect recruitment fraud, do not share personal information or make any payments and report the incident to your local authorities immediately.

How we rate this

Mechanical Engineer, Thermal & Packaging at Hewlett Packard Enterprise rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

  1. ●●●● Builds AI80 to 100
  2. ●●●○ Works on AI60 to 79
  3. ●●○○ Uses AI40 to 59
  4. ●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Mechanical EngineeringThermal DesignElectronics PackagingSimulationCreoCADCfd

Questions you could be asked

  1. Tell me about a project where mechanical engineering was part of your work. What did you do?
  2. Tell me about a project where thermal design was part of your work. What did you do?
  3. Tell me about a project where electronics packaging was part of your work. What did you do?
  4. Tell me about a project where simulation was part of your work. What did you do?
  5. Walk me through how you've used Creo in your day-to-day work.

Adapt your resume

  • List these exact terms on your resume: Mechanical Engineering, Thermal Design, Electronics Packaging, Simulation, and Creo. An applicant tracking system matches the wording, not the idea.
  • Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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