Module Development Engineer - LTD Dry Etch

Intel is hiring a Module Development Engineer - LTD Dry Etch. It pays $134k-$255k a year and Level rates it ; you can apply on Intel.

Level's read on this job

On Level's scale, this role is Little AI ●○○○: aI is not part of the work.
The posting mentions dry etch, process integration and design of experiments among its tools and skills.
Level classes it as a mid-level role.
Intel has 805 other open roles on Level.

AI in this role

Drive dry etch process development and manufacturing solutions for next-generation semiconductor patterning.

dry-etchprocess-integrationdesign-of-experimentsdefect-reductionstatistical-process-control

Job Details:

Job Description:

Business Group
Intel Foundry Technology Development is committed to delivering world-class manufacturing solutions that power Intel's product roadmap. The team leads advancements in semiconductor process engineering, enabling innovative device architectures and high-volume production. Joining this team means contributing to Intel's pursuit of excellence and maintaining its leadership in a dynamic, competitive market.

About the Role

Join Intel Logic Technology Development and help advance the next generation of patterning.

You will operate in a high impact space, partnering closely with cross functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long term systems that sustain performance. This role requires regular onsite presence to fulfill essential job responsibilities.

Drive technology development for future technology and high-volume manufacturing, provide process integration and equipment solutions, and perform feasibility studies to meet desired device specifications.
Own and drive development of the next generation patterning processes, including process architecture, optimization strategies, and qualification methodologies.
Perform pathfinding activities in support of process and hardware development on existing and first of kind equipment, enabling manufacturing of innovative device architectures and developing roadmaps for technologies enabling future roadmap.
Provide technical leadership for cross functional problem solving to resolve complex process and defect issues; drive structured root cause, containment, and permanent corrective actions.
Design and execute comprehensive characterization plans; plan and conduct experiments (DOE/response surface/robustness studies) across the development cycle.
Establish and mature control systems to optimize and sustain production performance (SPC, control plans, alarms, response plans, recipe governance, sustaining systems).
Develop strategies and infrastructure to resolve difficult problems and implement systems to manage these problems in the future (standard work, monitoring, dashboards/analytics, knowledge capture).
Drive improvements in yield, reliability, cost, productivity, and process capability, ensuring scalable transfer to manufacturing and ongoing sustainment.
Influence technical direction, mentor engineers (as appropriate for grade), and communicate status/risks clearly to stakeholders.
Recommend and implement modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
Partner with key equipment and material suppliers to develop and implement enabling elements of the technology. Perform process technology feasibility studies through theoretical simulations and/or practical engineering methods.

Core Competencies

Strong collaboration and problem-solving skills to work effectively in cross-disciplinary teams.
Ability to communicate technical data and concepts to both technical and non-technical audiences.

Qualifications:

The Minimum qualifications listed below are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience, academic projects, and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with relevant industry or graduate school research experience.
-Or-
Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 2 years of relevant industry or graduate school research experience.
-Or-
Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of industry experience at a leading foundry or dry etch equipment supplier.
Hands-on experience in dry etch semiconductor manufacturing, including ownership of process development and optimization.
Experience with plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms.
Experience delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability.
Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data-based decisions.

Preferred Qualifications:

4+ years of direct industry experience developing and deploying dry etch processes for advanced logic, foundry technologies or dry etch equipment suppliers.
Experience with advanced dry etch technologies such as: ICP / CCP plasma etch, High aspect ratio etch (HARC), Atomic Layer Etch (ALE), Radical and Vapor phase isotropic etching, Ash and surface treatments, EUV patterned layer etch integration.
Experience in managing complex process challenges and provide solutions such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion.
Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation.
Expertise in APC development and variability reduction in a manufacturing environment.
Expertise in etch driven defect reduction and metrology in a manufacturing environment.
Proven ability to lead technical problem solving across projects, influencing peers and stakeholders without formal people management responsibility.

Join Intel's passionate and innovative team to help define the future of semiconductor technology. Your expertise and dedication will contribute to groundbreaking advancements in manufacturing processes and device development, making a meaningful impact on Intel's technology roadmap.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Module Development Engineer - LTD Dry Etch at Intel rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Key facts

Module Development Engineer - LTD Dry Etch is an open job at Intel.
Level rates this role AI Level 1 of 4: Little AI.
The listed salary is $134k-$255k a year.
The role is based in US, Oregon, Hillsboro.
The job was posted on September 11, 2026.
Seniority: mid.
Applications are handled by Intel. Apply on Intel

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Dry EtchProcess IntegrationDesign Of ExperimentsDefect ReductionStatistical Process Control

Questions you could be asked

Tell me about a project where dry etch was part of your work. What did you do?
Tell me about a project where process integration was part of your work. What did you do?
Tell me about a project where design of experiments was part of your work. What did you do?
Tell me about a project where defect reduction was part of your work. What did you do?
Tell me about a project where statistical process control was part of your work. What did you do?

Adapt your resume

List these exact terms on your resume: Dry Etch, Process Integration, Design Of Experiments, Defect Reduction, and Statistical Process Control. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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