Module Engineer for Assembly Department

Intel is hiring a Module Engineer for Assembly Department in Ho Chi Minh City, Vietnam. Level rates it ; you can apply on Intel.

Level's read on this job

Level rates this role Little AI ●○○○: aI is not part of the work.
Tools and skills the posting cites include semiconductor manufacturing, equipment maintenance and process optimization.
Level classifies it as a mid-level role.
Level lists 860 other open roles at Intel.
The role was posted within the past two weeks.

AI in this role

Manage and optimize high-volume manufacturing equipment and processes for integrated circuit production.

semiconductor-manufacturingequipment-maintenanceprocess-optimizationautomation

Job Details:

Job Description:

The Role and Impact As a Module Engineer, you will be at the forefront of managing and optimizing high-volume manufacturing equipment and processes critical to the production of cutting-edge integrated circuits. You will conduct precise tests, implement improvements, and collaborate on technology transfers to ensure manufacturing excellence while meeting safety, quality, and cost goals. Your contributions will directly drive device miniaturization and process innovations that shape Intel's global manufacturing capabilities. Business Group Intel Corporation's Assembly Engineering group is a dynamic team focused on accelerating semiconductor manufacturing processes and technology development. The group plays an instrumental role in advancing high-volume production, fostering innovation, and enabling global technology transfers. By joining this team, you'll contribute to Intel's mission of creating world-changing technology that improves lives everywhere. Key Responsibilities - Manage critical high-volume manufacturing equipment and processes to support device miniaturization and integrated circuit production. - Conduct tests and measurements to ensure control over critical dimensions and defectivity within the production line. - Recommend and implement modifications to optimize production techniques and enhance manufacturing efficiencies. - Execute maintenance and repair activities for equipment and relevant module components. - Drive continuous improvement initiatives focused on safety, quality, cost, productivity, defects, and yield. - Collaborate with equipment suppliers to resolve technical issues and implement key improvements. - Develop and optimize systems for excursion prevention and discrepancy detection in materials and processes. - Participate in technology transfer and audit activities to ensure aligned standards across global manufacturing sites. - Lead equipment installation, conversion, and qualification during factory ramps, ensuring safety and quality standards are met.

Qualifications:

- Bachelor's degree or Master's degree in Mechanical Engineering, Mechatronics, Automation Control, Electronics, Data Science, Materials Science & Engineering, Metallurgy, Chemical Engineering or a related physical science/engineering discipline.

- Minimum 1–3 years of experience in semiconductor packaging, electronics manufacturing, or high-volume Surface Mount Technology (SMT) assembly environments.

- Proficient in both spoken and written English communication.

- Working knowledge of BGA package assembly and SMT manufacturing processes.

- Experience in yield improvement, quality engineering, and manufacturing problem-solving.

- Knowledge of BGA package assembly and SMT manufacturing processes.

- Knowledge of FMEA, PFMEA, Control Plans, SPC, and corrective/preventive action methodologies.

- Knowledge of data analysis tools, scripting and programing such as JMP, SQL, Power BI, Python.

- Strong troubleshooting, analytical, and root-cause investigation skills.

- Ability to work effectively across multiple engineering disciplines and manufacturing organizations.

Additional preferred qualifications include:

- Experience supporting automated inspection systems and vision-based manufacturing equipment.

- Familiarity with quality methodologies such as Six Sigma, DMAIC, 8D, FMEA, and Statistical Process Control.

- Experience driving yield improvement projects in semiconductor or electronics manufacturing.

You bring relevant experience in one or more of the following areas:

-Hands-on experience sustaining automated optical inspection, visual inspection, or automated manufacturing equipment.

-Hands-on experience sustaining, programming, and troubleshooting -automated stencil printing systems, 3D Solder Paste Inspection (SPI), multizone reflow ovens, and aqueous/chemical deflux cleaning modules.

-Process Metallurgy & Joint Reliability: Working knowledge of BGA package assembly, lead-free solder metallurgy (SAC alloys, low-temperature Bismuth), intermetallic compound (IMC) growth control, and package warpage due to Coefficient of Thermal Expansion (CTE) mismatch.

-Hands-on experience with industrial imaging hardware, High-Precision 2D/3D Metrology.

-Proven experience with successful projects with main task of developing automation script and app that improve manufacturing processes (including process optimization, add-in detection capabilities using image processing / ML / AI).

Join us to be part of shaping the future of technology with impactful contributions to global manufacturing operations. Your journey with us will foster innovation, collaboration, and personal growth.

Job Type:

Experienced Hire

Shift:

Shift 1 (Vietnam)

Primary Location:

Vietnam, Ho_Chi_Minh_City

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Privacy Statement:

Your privacy matters to Intel and we comply with applicable data protection laws. We collect and maintain personal information for recruitment related activities and your data will not be used for any other purpose. We retain personal information for the periods and purposes set forth in Intel Privacy Notice. Retention periods can vary significantly based on the type of information and how it is used. We do not share your personal information with third parties.

In order for Intel to communicate with you on your application results, by submitting your information and proceeding with this application, you agree and consent that we can collect your personal information. You will have the ability to opt-out by informing vietnamjobs@intel.com or at any time selecting unsubscribe found at the bottom of our future marketing communications. You have rights to correct, update, request access to or deletion of your personal information as described in Intel Privacy Notice. In addition, if you wish to update or otherwise make changes to your resume, use Intel online application tool to resubmit a new resume.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Module Engineer for Assembly Department at Intel rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Key facts

Module Engineer for Assembly Department is an open job at Intel.
Level rates this role AI Level 1 of 4: Little AI.
The role is based in Vietnam, Ho_Chi_Minh_City.
The job was posted on October 26, 2026.
Seniority: mid.
Applications are handled by Intel. Apply on Intel

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Semiconductor ManufacturingEquipment MaintenanceProcess OptimizationAutomation

Questions you could be asked

Tell me about a project where semiconductor manufacturing was part of your work. What did you do?
Tell me about a project where equipment maintenance was part of your work. What did you do?
Tell me about a project where process optimization was part of your work. What did you do?
Tell me about a project where automation was part of your work. What did you do?

Adapt your resume

List these exact terms on your resume: Semiconductor Manufacturing, Equipment Maintenance, Process Optimization, and Automation. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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