Oregon Advanced Packaging Module Engineer

Intel is hiring an Oregon Advanced Packaging Module Engineer. It pays $76k-$146k a year and Level rates it ; you can apply on Intel.

Level's read on this job

Little AI ●○○○ is how Level rates this role: aI is not part of the work.
Tools and skills the posting cites include semiconductor manufacturing, process engineering and equipment ownership.
Level classifies it as a mid-level role.
Level lists 842 other open roles at Intel.
The role was posted within the past two weeks.

AI in this role

Advanced Packaging Module Engineer to manage high-volume semiconductor manufacturing equipment and processes at Intel.

semiconductor-manufacturingprocess-engineeringequipment-ownershipcontinuous-improvement

Job Details:

Job Description:

At Intel, we create world-changing technology that improves the life of every person on the planet. By joining the Oregon Advanced Packaging (ORAP) team—supporting both our Aloha and Ronler factories—you will become part of the Wafer Packaging Manufacturing (WPM) organization. Our mission is to deliver world-class manufacturing solutions through advanced wafer-level processes and packaging technologies, enabling high-volume production, supporting global technology transfer, and driving the innovations that shape the future of computing.

We are seeking an Oregon Advanced Packaging Module Engineer to join our advanced manufacturing operations in Hillsboro, Oregon. In this role, you will play a critical part in driving Intel’s advanced semiconductor manufacturing processes. You will own high-volume packaging equipment and processes that enable the miniaturization and mass production of integrated circuits. This position offers an exceptional career path to design process controls, execute continuous improvement initiatives, and work directly on cutting-edge systems that impact Intel's global production roadmap.

Key Responsibilities:

Equipment & Process Ownership: Manage high-volume manufacturing equipment and processes to support device miniaturization and the production of next-generation integrated circuits.
Process Control & Metrology: Conduct technical tests and measurements to maintain critical process control for dimensions and inline defectivity.
Excursion Prevention: Develop, implement, and monitor systems for excursion prevention and discrepant material detection within the equipment modules.
Technology Transfer: Partner with global Intel manufacturing sites to transfer process qualification outcomes, coordinate training, and align performance metrics.
Continuous Improvement: Lead engineering initiatives focused on safety, quality, productivity, cost reduction, and systematic defect reduction.
Factory Ramp Management: Coordinate equipment installations, conversions, and qualifications during factory ramps to ensure tooling is brought online safely and on schedule.
Supplier Collaboration: Partner directly with equipment and material suppliers to optimize tool configurations and materials for high-volume manufacturing.

As a Successful Candidate, You Will Bring:

Technical Leadership & Collaboration: Natural leadership skills to guide cross-functional teams, influence global partners, and work effectively across organizational boundaries.
Problem-Solving & Innovation: Highly analytical mindset with a passion for diagnosing complex electromechanical and process issues using structured data.
Adaptability & Tolerance for Ambiguity: Comfortable operating in a rapidly changing, fast-paced high-volume manufacturing environment.
Meticulous Attention to Detail: Commitment to precision, safety, and strict compliance with design-to-target standards.

Apply today to join Intel Oregon's Advanced Packaging team. Take ownership of industry-leading technology, drive manufacturing innovation, and grow your career alongside global pioneers.

Qualifications:

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.

Minimum Qualifications:

An applicant must meet one of the following criteria:

A Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related STEM field and 1+ years of hands-on experience in semiconductor manufacturing or high-tech process equipment.
OR a Master's degree in a matching STEM discipline.
Relevant experience can be any of the following:
- 6+ months of experience applying statistical methods (e.g., Statistical Process Control, design of experiments) to manufacturing processes.
- Academic or professional experience acquired through internships, academic projects, coursework, or hands-on technical training.

Preferred Qualifications:

6+ months of experience:
- Troubleshooting equipment or analytical instruments in a semiconductor environment.
- Utilizing statistical analysis tools (such as MATLAB, JMP, or Excel) for process optimization.
- Utilizing materials characterization techniques.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $76,390.00-146,440.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Oregon Advanced Packaging Module Engineer at Intel rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Key facts

Oregon Advanced Packaging Module Engineer is an open job at Intel.
Level rates this role AI Level 1 of 4: Little AI.
The listed salary is $76k-$146k a year.
The role is based in US, Oregon, Hillsboro.
The job was posted on October 27, 2026.
Seniority: mid.
Applications are handled by Intel. Apply on Intel

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Semiconductor ManufacturingProcess EngineeringEquipment OwnershipContinuous Improvement

Questions you could be asked

Tell me about a project where semiconductor manufacturing was part of your work. What did you do?
Tell me about a project where process engineering was part of your work. What did you do?
Tell me about a project where equipment ownership was part of your work. What did you do?
Tell me about a project where continuous improvement was part of your work. What did you do?

Adapt your resume

List these exact terms on your resume: Semiconductor Manufacturing, Process Engineering, Equipment Ownership, and Continuous Improvement. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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