Packaging Module Development Engineer

AI in this role

Job Details:

Job Description:

Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization.
CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process.
Candidate will focus on Process and Technology Development for Electronic packaging assembly process on New Product and Test Vehicle.
Technical knowledge in Research and Development, Process Development, Process Engineering, Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA), Quality, Yield Improvement, Optimization.
Pathfinding, developing, qualifying, and ramping materials to transfer to high volume manufacturing process in factories.
Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
Conducting fundamental studies and performing experiments to characterize materials, process, identify potential failure modes, understand the performance interactions, optimization, assess feasibility of technology use on product, and make technology recommendations.
Collaborating closely with other cross-functional team to build material technologies on test vehicles and products and assessing their performance.

Qualifications:

BEng/MEng/MSc/PhD degree in relevant engineering disciplines (Mechanical, Materials, Chemical, Electrical, Physics, Mechatronics),
Research and Development background from MSc/PhD is preferred.
More than 2 years working experience in electronic packaging AND/OR development experience is required.
Open to fresh graduate with strong academic result.
Research and Development background and experience in Chip Attach, Deflux or Ball Attach Process.
Excellent influencing, written and verbal communication skills.
Strong data analysis capabilities and problem solving skills.
Proactive and positive approach towards challenges.
Able to work under tight timelines and schedules, and perform under pressure.

Job Type:

Experienced Hire

Shift:

Shift 1 (Malaysia)

Primary Location:

Malaysia, Kulim

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Packaging Module Development Engineer at Intel rates 33 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.