Packaging Module Development Engineer

Intel is hiring a Packaging Module Development Engineer. It pays $156k-$220k a year and Level rates it ; you can apply on Intel.

Level's read on this job

On Level's scale, this role is Little AI ●○○○: aI is not part of the work.
Tools and skills the posting cites include Statistical Process Control, semiconductor packaging and metrology.
Level classifies it as a mid-level role.
Level lists 842 other open roles at Intel.
The role was posted within the past two weeks.

AI in this role

Develop, optimize, and implement advanced semiconductor packaging metrology capabilities and manufacturing processes.

Statistical Process Control

semiconductor-packagingmetrologyprocess-engineeringequipment-qualification

Job Details:

Job Description:

The Role and Impact

As a Module Development Engineer within Intel's Advanced Packaging Technology Development (APTD) Metrology Group, you will contribute to the development, optimization, and implementation of advanced metrology capabilities supporting Intel's next-generation semiconductor packaging technologies.

Your work will combine hands-on equipment and process development, equipment qualification, manufacturing process optimization, and technology development initiatives. You will support both existing metrology operations and the evaluation of emerging technologies that enable future manufacturing capabilities.

Collaborating with cross-functional teams across process integration, module engineering, advanced process control, automation, and equipment suppliers, you will help improve manufacturing readiness, equipment performance, and process capabilities while contributing to Intel's long-term technology roadmap.

About the Group

The APTD Metrology Group at Intel supports critical semiconductor technology development programs by enabling advanced measurement and inspection capabilities.

As packaging technologies continue to evolve, metrology plays an essential role in process development, yield improvement, and manufacturing readiness.

The group works closely with engineering, manufacturing, and technology development teams to introduce innovative measurement solutions and support Intel's next-generation semiconductor technologies.

Key Responsibilities

Contribute to the development and execution of metrology technology roadmaps by evaluating emerging equipment capabilities, industry trends, and future manufacturing requirements.
Participate in technology development and pathfinding initiatives, including feasibility studies, process evaluations, and the introduction of new metrology capabilities.
Support the installation, qualification, characterization, and validation of new metrology and inspection equipment to ensure manufacturing readiness.
Own and support metrology equipment and manufacturing processes, including equipment troubleshooting, process monitoring, recipe development, and continuous improvement activities.
Develop, optimize, and implement manufacturing process improvements to enhance equipment performance, process stability, yield, and operational efficiency.
Support metrology module development activities, including recipe optimization, process parameter evaluation, statistical process control (SPC), and sampling strategies.
Investigate manufacturing process excursions, perform root cause analysis, and implement corrective actions to improve equipment and process performance.
Collaborate with equipment suppliers and cross-functional engineering teams to evaluate new technologies, resolve technical challenges, and support equipment development initiatives.
Partner with process integration, manufacturing, automation, and advanced process control teams to implement process improvements and enhance manufacturing capabilities.
Provide technical insights, process performance data, and recommendations to support engineering decisions, technology development projects, and manufacturing readiness reviews.

Your contributions will help advance Intel's semiconductor manufacturing capabilities while supporting the development of next-generation advanced packaging technologies.

Qualifications:

Minimum Qualifications

Candidates must possess one of the following:

Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related STEM field with 6+ years of semiconductor manufacturing experience, including manufacturing process development and application of statistical process control (SPC), data analysis, and/or process improvement methodologies.

Master's degree in the same fields with 4+ years of semiconductor manufacturing experience, including manufacturing process development and application of statistical process control (SPC), data analysis, and/or process improvement methodologies.

PhD in the same fields with 2+ years of semiconductor manufacturing experience, including manufacturing process development and application of statistical process control (SPC), data analysis, and/or process improvement methodologies.

Preferred Qualifications

Experience owning, sustaining, or optimizing semiconductor metrology or inspection equipment, including equipment recipes and process performance.
Experience contributing to technology development initiatives, equipment capability evaluations, or future technology roadmaps.
Recognized technical leadership with a proven ability to solve complex engineering challenges.
Strong collaboration skills across cross-functional teams, including yield, operations, and supplier management.

Intel invites forward-thinking engineers to join us in shaping the future of semiconductor technology. Contribute your expertise and creativity to help drive innovation and make an impact at Intel. Apply today.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $155,520.00-219,550.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Packaging Module Development Engineer at Intel rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Key facts

Packaging Module Development Engineer is an open job at Intel.
Level rates this role AI Level 1 of 4: Little AI.
The listed salary is $156k-$220k a year.
The role is based in US, Oregon, Hillsboro.
The job was posted on October 29, 2026.
Seniority: mid.
Applications are handled by Intel. Apply on Intel

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Semiconductor PackagingMetrologyProcess EngineeringEquipment QualificationStatistical Process Control

Questions you could be asked

Tell me about a project where semiconductor packaging was part of your work. What did you do?
Tell me about a project where metrology was part of your work. What did you do?
Tell me about a project where process engineering was part of your work. What did you do?
Tell me about a project where equipment qualification was part of your work. What did you do?
Walk me through how you've used Statistical Process Control in your day-to-day work.

Adapt your resume

List these exact terms on your resume: Semiconductor Packaging, Metrology, Process Engineering, Equipment Qualification, and Statistical Process Control. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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