Packaging Module Equipment Development Engineer

Intel is hiring a Packaging Module Equipment Development Engineer in Phoenix, United States. It pays $99k-$189k a year and Level rates it ; you can apply on Intel.

Level's read on this job

Little AI ●○○○ is how Level rates this role: aI is not part of the work.
The posting mentions packaging development, process engineering and design of experiments among its tools and skills.
Level classes it as a mid-level role.
Intel has 805 other open roles on Level.

AI in this role

Develop and optimize semiconductor assembly and packaging processes and manufacturing equipment.

packaging-developmentprocess-engineeringdesign-of-experimentsequipment-reliability

Job Details:

Job Description:

The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful.

The Role and Impact
Join Intel's Packaging Module Development team and play a pivotal role in pioneering assembly packaging technologies that drive Intel's future advancements. As a Packaging Module Development Engineer, you will develop innovative processes and refine equipment to enable next-generation packaging solutions and enhance US based manufacturing. Your contributions will directly impact manufacturing efficiency, product reliability, and technological innovation, ensuring Intel remains at the forefront of the global semiconductor industry.

Business group
Intel's Packaging Module Development team focuses on advancing assembly and packaging solutions that enable cutting-edge technologies across Intel's diverse product portfolio. The group collaborates with cross-functional teams to optimize manufacturing processes, enhance product reliability, and support Intel's mission to deliver world-class innovations that transform the way we compute.

Key Responsibilities:

Develop and optimize assembly processes and equipment to meet stringent quality, reliability, cost, yield, productivity, and manufacturability goals.
Apply Design of Experiments (DOE) principles and statistical methods to refine processes and specifications, equipment capabilities and gaps, and documenting findings through technical reports.
Ensure manufacturability of physical layouts in package designs, overseeing the lifecycle of manufacturing equipment health and long-term reliability from development through high volume manufacturing
Support integration of new materials and architectures into equipment for manufacturing success for advanced foundry customer product manufacturability
Innovate new techniques, tools, and quality screens to proactively identify and address equipment health and reliability issues.
Lead problem-solving initiatives and continuous improvement efforts for processes and equipment.
Standardize equipment qualification practices and manufacturing quality systems while addressing technical risks aligned with product milestones.

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Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences.

Minimum Qualifications:

US Citizenship
Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience OR Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 1+ years of relevant experience OR PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field.
Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.

Preferred Qualifications:

Demonstrated ability to lead technical innovation and manage complex, time-sensitive projects.
Experience with high-volume manufacturing including equipment troubleshooting and change qualification
Understanding of semiconductor fabrication processes and packaging technologies.
Familiarity with equipment install and qualification
Experience with optimization of procedures or design for safety, quality and/or cost-effective manufacturability

Collaborate with world-class teams, tackle meaningful challenges, and redefine industry standards while advancing your career. Apply today and become a key contributor to Intel's mission to shape the future of technology.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Packaging Module Equipment Development Engineer at Intel rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Key facts

Packaging Module Equipment Development Engineer is an open job at Intel.
Level rates this role AI Level 1 of 4: Little AI.
The listed salary is $99k-$189k a year.
The role is based in US, Arizona, Phoenix.
The job was posted on August 20, 2026.
Seniority: mid.
Applications are handled by Intel. Apply on Intel

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Packaging DevelopmentProcess EngineeringDesign Of ExperimentsEquipment Reliability

Questions you could be asked

Tell me about a project where packaging development was part of your work. What did you do?
Tell me about a project where process engineering was part of your work. What did you do?
Tell me about a project where design of experiments was part of your work. What did you do?
Tell me about a project where equipment reliability was part of your work. What did you do?

Adapt your resume

List these exact terms on your resume: Packaging Development, Process Engineering, Design Of Experiments, and Equipment Reliability. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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