Process Integration, Yield, Defect Reduction Engineering Lead

Job Description:

The Role and Impact

As a Process Integration and Yield Engineer, you will play a pivotal role in driving technology improvement and manufacturing excellence. You will define process integration roadmaps, analyze large volumes of structured and unstructured data, and implement solutions that enhance quality, yield, and defect reduction. Working across internal and external teams, your contributions will directly support ramping advanced packaging solutions and sustaining high-volume manufacturing processes.

Business Group

Join Intel Corporation's global team responsible for advancing technology solutions that enable high-volume manufacturing and yield improvement. This group focuses on integrating innovative processes and driving continuous improvement, ensuring Intel delivers high-quality, reliable products for customers worldwide. Be part of a collaborative environment committed to shaping the future of technology and solving complex challenges.

Key Responsibilities

- Define and establish process flows, procedures, and equipment configurations for manufacturing modules.
- Extract insights from data using statistical analysis, coding, and machine learning techniques.
- Drive yield analysis and defect reduction initiatives to support process improvement.
- Conduct quality and reliability risk assessments for manufacturing materials and process changes.
- Collaborate with cross-functional teams to ensure successful technology transfer and ramp-up activities.
- Develop monitoring systems, dashboards, and methodologies to sustain and enhance manufacturing performance.
- Lead low yield analysis and yield improvement activities in both startup and high-volume manufacturing environments.

The ideal candidate should exhibit the following behavioral traits:

• Strong troubleshooting skills and innovative problem-solving approaches.
• Excellent verbal and written communication skills.

Qualifications:

Minimum Qualifications

- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Microelectronics Engineering, Chemistry, Physics, or related field and 4+ year of experience.

OR

Master’s degree in the fields above with 3+ years of experience.

OR

PhD degree in the fields above with 1+ years of experience.

Experience listed above should be a combination of the following:

• Experience in semiconductor manufacturing or advanced packaging.
• Expertise in process integration, defect reduction, and backend interconnect or advanced packaging processes.
• Experience in statistical analysis tools such as JMP, SQL, and statistical process control (SPC).
• Experience with Design of Experiments (DOE) principles and Failure Mode Effects Analysis (FMEA)
  

Preferred Qualifications

• Experience presenting yield summaries and engaging with external foundry customers.
• Demonstrated ability to analyze defects and parametric data to drive yield improvements
• Proven track record in new semiconductor technology development and transfer.

Take the next step to advance your career by joining Intel, where you can make a meaningful impact on cutting-edge technologies that shape the future.

Job Type:

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Posting Statement:

Position of Trust

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Work Model for this Role

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