Senior IC Packaging Process Engineer

NVIDIA is hiring a Senior IC Packaging Process Engineer. Level rates it ; you can apply on NVIDIA.

Level's read on this job

Little AI ●○○○ is how Level rates this role: aI is not part of the work.
Level classifies it as a senior role.
Level lists 2,700+ other open roles at NVIDIA.
The role was posted in the last few days.

AI in this role

At NVIDIA, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Senior Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.

What you'll be doing:

Lead adhesive and bonding process development for advanced FCBGA packaging, including surface preparation, surface coatings and process optimization for applications requiring optical alignment and high dimensional stability.
Design and execute Design of Experiments (DOE) for adhesive material qualification, process window definition, and process optimization including failure analysis.
Evaluate and qualify new materials (adhesives, encapsulants, underfills) from vendors including characterization of cure chemistry, thermal stability, and mechanical properties
Define and own incoming material acceptance criteria and statistical process control (SPC) thresholds for production readiness
Collaborate with partners and material suppliers to resolve process escapes, drive 8D corrective actions, and align on specification requirements
Prepare process documentation, assembly specs, and material qualification reports
Monitor and analyze production data to identify process trends, drive yield improvements, and ensure ongoing process control across OSAT manufacturing sites.

What we need to see:

B.Sc. or M.Sc. in Materials Science, Chemical Engineering, or a related field
7+ years of experience in process engineering, with hands-on expertise in adhesive process development.
Proven experience with failure analysis techniques: cross-sectioning, SEM/EDX, optical microscopy, DSC, TGA, and FTIR
Willingness and ability to travel internationally approximately 30% of the time to support OSAT partners, supplier qualifications, and on-site failure investigations
Ability to work independently in a fast-paced, multi-program environment
Curious and creative problem solver as well as organized and multi-tasker
Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written)
High awareness of quality, manufacturability and project schedule

Ways to stand out of the crowd:

Proven record in packaging development
Background in semiconductor manufacturing processes and optical systems

How we rate this

Senior IC Packaging Process Engineer at NVIDIA rates 37 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.