Silicon Photonics Packaging Engineer Co-op

Nokia is hiring a Silicon Photonics Packaging Engineer Co-op. Level rates it ; you can apply on Nokia.

Level's read on this job

On Level's scale, this role is Little AI ●○○○: aI is not part of the work.
Tools and skills the posting cites include Ansys, silicon photonics and optical packaging.
Level classifies it as an internship.
Level lists 576 other open roles at Nokia.
The role was posted in the last few days.

AI in this role

Engage in research and development of silicon photonics transceiver modules, developing semiconductor and optical packaging processes.

ansys

silicon-photonicsoptical-packagingthermal-simulationsemiconductor-packaging

Number of Positions: 2
Duration: 4 months
Date: January 2027-June 2027
Location: Onsite in Sunnyvale, CA,

Education Recommendations

Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or other similar fields with an accredited university in the USA.

We are searching for a Silicon Photonics Packaging Co-op for our Spring 2027 Term to engage in the research and development of silicon photonics transceiver modules.

Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
Design optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
Own Design Rules documents and ensure Design for Manufacturing specifications are met.
Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
Drive package debug activities during product validation and qualification.
Plan and Drive prototype assembly builds to enable deliveries for early design validation.
Apply in-depth knowledge of advanced packaging principles and stay current with new technological advancements.

Experience with package and process design/development from design to production.
Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
Experience with documentation of fabrication, inspection, and assembly processes.
Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.

It would be nice if you also had:

Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/ 3D packages.
Experience in the semiconductor chip and wafer-level back-end processing, assembly, and/or packaging.
Experience in high-speed electronics package design and/or laser package design.
Experience with thermo-mechanical simulations using ANSYS or similar software.
Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.
Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.

How we rate this

Silicon Photonics Packaging Engineer Co-op at Nokia rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Key facts

Silicon Photonics Packaging Engineer Co-op is an open job at Nokia.
Level rates this role AI Level 1 of 4: Little AI.
The role is based in United States.
The job was posted on October 30, 2026.
Seniority: intern.
Applications are handled by Nokia. Apply on Nokia

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Silicon PhotonicsOptical PackagingThermal SimulationSemiconductor PackagingAnsys

Questions you could be asked

Tell me about a project where silicon photonics was part of your work. What did you do?
Tell me about a project where optical packaging was part of your work. What did you do?
Tell me about a project where thermal simulation was part of your work. What did you do?
Tell me about a project where semiconductor packaging was part of your work. What did you do?
Walk me through how you've used Ansys in your day-to-day work.

Adapt your resume

List these exact terms on your resume: Silicon Photonics, Optical Packaging, Thermal Simulation, Semiconductor Packaging, and Ansys. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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