AmazonSr. Package Engineer, Annapurna Labs - AI Silicon Packaging
Amazon is hiring a Sr. Package Engineer, Annapurna Labs - AI Silicon Packaging in Austin, United States. It pays $185k-$250k a year and Level rates it ; you can apply on Amazon.
Level's read on this job
- On Level's scale, this role is Builds AI ●●●●: the job is building AI systems.
- Tools and skills the posting cites include packaging technology, substrate technology and hardware acceleration.
- Level classifies it as a senior role.
- Level lists 21,000+ other open roles at Amazon.
- The role was posted within the past week.
AI in this role
Define and drive package technology development for next-generation Trainium AI accelerators at Annapurna Labs.
The Package Technology Development team within Annapurna Labs is building the packaging, substrate/PCB, interposer, and assembly technologies for the next-generation Trainium AI accelerators. The team works at the intersection of silicon, package, board, system, and rack, partnering closely with design, manufacturing, supply chain, and reliability teams to bring bleeding-edge AI systems from concept to volume production.
Key job responsibilities
- Define and drive package technology development across architecture, design, materials, processes, yield, warpage, reliability, and system-level integration for next-generation Trainium systems, from early concept through volume production.
- Partner with OSATs and component/material/equipment suppliers on capability validation, test vehicle development, qualification, TGA, FMEA, risk retirement, root-cause analysis, and corrective/preventive actions
- Evaluate tradeoffs across performance, cost, yield, manufacturability, warpage, thermal performance, and reliability to guide technology decisions and qualification strategies.
- Represent the package technology team in cross-functional design reviews, sign-off milestones, and program checkpoints with silicon, board, system, and supply chain teams.
- Identify opportunities for novel packaging architectures and process simplifications to reduce cost, improve yield, and accelerate time-to-market.
Basic qualifications
- Experience coordinating between technical teams, peers and business stakeholders
- Bachelor's in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or 10+ years of industry experience in a related field
- Expertise in at least one: substrate/PCB technology, interposer technology, or package and board assembly technology
- Track record of driving technology development from concept through qualification
Preferred qualifications
- Master's in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or 8+ years of industry experience in a related field
- Or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or 6+ years of industry experience in a related field
- Familiarity with package-level SI/PI concepts (impedance control, PDN design, crosstalk-aware routing) sufficient to collaborate with SI/PI engineers
- Experience with substrate/PCB architecture, materials, processes, yield, warpage, and DFM for advanced systems, including HDI, microvias, fine-line/space, and high-speed/power routing
- Experience with interposer fabrication and DFM for 2.5D/3D systems (e.g., CoWoS-R/L), including RDL, TSV, silicon bridges, microbumps, and package floorplanning
- Experience with package and board assembly processes, including flip-chip, thermal compression bonding, hybrid bonding, underfill, molding, TIM, and fine-pitch assembly. Co-packaged optics (CPO) experience is a plus.
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.
The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.
USA, AZ, Tempe - 185,200.00 - 250,000.00 USD annually
USA, TX, Austin - 185,200.00 - 250,000.00 USD annually
How we rate this
Sr. Package Engineer, Annapurna Labs - AI Silicon Packaging at Amazon rates 80 out of 100 for how much of the daily work is AI. That makes it Builds AI (AI Level 4 of 4). The level is about AI in the job, not seniority.
Builds AI. The job is building AI systems.
- ●●●● Builds AI80 to 100
- ●●●○ Works on AI60 to 79
- ●●○○ Uses AI40 to 59
- ●○○○ Little AI0 to 39
Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.
Prepare for this job
Built from this posting and from similar jobs on Level.
Skills and AI tools this role asks for
Questions you could be asked
- Tell me about a project where packaging technology was part of your work. What did you do?
- Tell me about a project where substrate technology was part of your work. What did you do?
- Tell me about a project where hardware acceleration was part of your work. What did you do?
- Tell me about a project where thermal management was part of your work. What did you do?
- Tell me about a project where materials science was part of your work. What did you do?
Adapt your resume
- List these exact terms on your resume: Packaging Technology, Substrate Technology, Hardware Acceleration, Thermal Management, and Materials Science. An applicant tracking system matches the wording, not the idea.
- Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.
- Lead with what you built, trained or shipped. This role is judged on the AI system itself, not the tools around it.
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