AmazonSr. Thermal & Mechanical Packaging Engineer, Annapurna Labs
Amazon is hiring a Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs in Austin, United States. It pays $185k-$250k a year and Level rates it ; you can apply on Level.
AI in this role
Senior thermal and mechanical packaging engineer designing advanced data center server hardware for machine learning acceleration infrastructure.
Key job responsibilities
As a Sr. Thermal & Mechanical Packaging Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design including thermal and mechanical solutions and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the hardware that goes into our cutting-edge data centers affecting millions of AWS users.
Basic qualifications
- Experience communicating with customers, technical, regulatory, business teams, and management to collect requirements, describe product features, and technical designs
- Master's degree in mechanical engineering or equivalent
- 5+ years industry experience in advanced packaging of semiconductors.
- Direct experience in designing and testing of test vehicles to assess future packaging architectures and evaluating properties of next-generation materials.
- Expertise in optimizing in packaging architectures to meet quality, performance, and cost goals.
- 10+ years industry experience in mechanical design of semiconductor-based systems – silicon, packaging, and system design.
- Industry experience of working with packaging component vendors and ODMs, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization.
- Proficiency with simulation tools such as ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK or equivalent FEA/CFD software
Preferred qualifications
- Experience in advanced packaging metrologies for characterization, and design validation of semiconductor components, packages, and platforms. Hands-on experience with lab-based thermal and mechanical measurements, including instrumentation, infrared thermography, acoustic chambers, mechanical stress/strain gauges, power measurement equipment, and thermal test setups for package and system-level characterization.
- Strong understanding of product development lifecycles from concept through high volume manufacturing
- Experience with various types of technologies used for Heatsink solutions, Thermal Interface Materials (TIMs) and liquid cooling technologies - including cold plate design. Working knowledge on fans, UQDs, manifolds, and CDUs.
- Developed detailed CFD and compact RC models for SoC and Package thermal analysis. Experience correlating simulation models with experimental data and iterating designs based on empirical findings.
- Demonstrated ability to design, set up, and execute experiments in a lab environment, including building custom test fixtures, operating data acquisition systems, and performing root-cause failure analysis on hardware. Experience with Design of Experiments (DOE) and Six Sigma methodologies.
- Knowledge of hardware and software based thermal / power management control algorithms
- Validated thermal models through power/thermal measurements on Hardware
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.
The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.
USA, TX, Austin - 185,200.00 - 250,000.00 USD annually
How we rate this
Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs at Amazon rates 85 out of 100 for how much of the daily work is AI. That makes it Builds AI (AI Level 4 of 4). The level is about AI in the job, not seniority.
Builds AI. The job is building AI systems.
- ●●●● Builds AI80 to 100
- ●●●○ Works on AI60 to 79
- ●●○○ Uses AI40 to 59
- ●○○○ Little AI0 to 39
Levels come from how often the tools, models and workflows of the role are named in the posting itself. Open the description and count.
Prepare for this job
A free preview built only from this posting: what it asks for, what you could be asked in an interview, and how to adjust your resume.
Skills and AI tools this role asks for
Questions you could be asked
- Tell me about a project where thermal design was part of your work. What did you do?
- Tell me about a project where mechanical packaging was part of your work. What did you do?
- Tell me about a project where semiconductor packaging was part of your work. What did you do?
- Tell me about a project where fea was part of your work. What did you do?
- Tell me about a project where cfd was part of your work. What did you do?
Adapt your resume
- List these exact terms on your resume: Thermal Design, Mechanical Packaging, Semiconductor Packaging, Fea, and Cfd. An applicant tracking system matches the wording, not the idea.
- Attach one line of real, concrete experience to at least one of them — a tool named with nothing behind it rarely survives a human read.
- Lead with what you built, trained or shipped — this role is judged on the AI system itself, not the tools around it.
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