Thermal & Mechanical Engineer, Annapurna Labs - AI Silicon Packaging

Amazon is hiring a Thermal & Mechanical Engineer, Annapurna Labs - AI Silicon Packaging in Austin, United States. It pays $154k-$215k a year and Level rates it ; you can apply on Amazon.

Level's read on this job

Little AI ●○○○ is how Level rates this role: aI is not part of the work.
Level classifies it as a senior role.
Level lists 21,000+ other open roles at Amazon.
The role was posted in the last few days.

AI in this role

As a member of the Machine Learning Acceleration team you'll be responsible for the design and optimization of hardware in our data centers. You'll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you'll work with thought leaders in multiple technology areas. You'll have high standards for yourself and everyone you work with, and you'll be constantly looking for ways to improve your products performance, quality and cost. We're changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.

Key job responsibilities
- Perform finite element simulations and analytical modeling to evaluate assembly, test, and reliability risks for advanced semiconductor packages
- Design and execute experiments on materials and packaging or system structures to validate performance and inform design decisions
- Develop risk evaluations for future Annapurna packages, providing data-driven recommendations that shape next-generation package designs
- Collaborate with Quality and Reliability, Package Design, Test, and System Design teams to optimize package architectures and resolve cross-functional technical challenges
- Communicate findings through clear documentation and design reviews, contributing to specifications and trade-off analyses that guide team decisions

A day in the life
Your primary focus is ensuring the thermal and mechanical integrity of Annapurna's semiconductor packages. On a given day you might run finite element simulations to stress-test a new package stackup, then head to the lab to collect experimental data on material behavior under thermal cycling. You'll review results with Package Design engineers, flag risks to the Quality and Reliability team, and refine your models based on real-world feedback — all while keeping an eye on how your work feeds into the next product generation.

About the team
Annapurna Labs, our organization within Amazon Web Services (AWS), designs custom silicon and software that accelerates cloud innovation. Within Annapurna, the Packaging team focuses on the thermal, mechanical, and materials engineering challenges that come with pushing semiconductor package performance forward. We work closely with Quality and Reliability, Package Design, Test, and System Design groups to deliver robust, manufacturable solutions at data-center scale.

Our team values collaboration and knowledge sharing. We are investing in advanced packaging technologies to support the growing demands of machine learning and compute workloads, and you will play a direct role in shaping those next-generation solutions.

Basic qualifications

- Bachelor's degree in mechanical engineering or equivalent
- 5+ years industry experience in mechanical design of semiconductor-based systems – silicon, packaging, and system design
- 3+ years industry experience in advanced packaging of semiconductors
- Direct experience in designing and testing of test vehicles to assess future packaging architectures and evaluating properties of next-generation materials
- Expertise in optimizing in packaging architectures to meet quality, performance, and cost goals
- Industry experience of working with packaging component vendors and ODMs, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization
- Proficiency with simulation tools such as ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK or equivalent FEA/CFD software

Preferred qualifications

- Experience in advanced packaging metrologies for characterization, and design validation of semiconductor components, packages, and platforms. Hands-on experience with lab-based thermal and mechanical measurements, including instrumentation, infrared thermography, acoustic chambers, mechanical stress/strain gauges, power measurement equipment, and thermal test setups for package and system-level characterization.
- Strong understanding of product development lifecycles from concept through high volume manufacturing
- Experience with various types of technologies used for Heatsink solutions, Thermal Interface Materials (TIMs) and liquid cooling technologies - including cold plate design. Working knowledge on fans, UQDs, manifolds, and CDUs.
- Developed detailed CFD and compact RC models for SoC and Package thermal analysis. Experience correlating simulation models with experimental data and iterating designs based on empirical findings.
- Demonstrated ability to design, set up, and execute experiments in a lab environment, including building custom test fixtures, operating data acquisition systems, and performing root-cause failure analysis on hardware. Experience with Design of Experiments (DOE) and Six Sigma methodologies.
- Knowledge of hardware and software based thermal / power management control algorithms
- Validated thermal models through power/thermal measurements on Hardware

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.

The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.

USA, TX, Austin - 153,600.00 - 215,000.00 USD annually

How we rate this

Thermal & Mechanical Engineer, Annapurna Labs - AI Silicon Packaging at Amazon rates 21 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Key facts

Thermal & Mechanical Engineer, Annapurna Labs - AI Silicon Packaging is an open job at Amazon.
Level rates this role AI Level 1 of 4: Little AI.
The listed salary is $154k-$215k a year.
The role is based in US, TX, Austin.
The job was posted on October 30, 2026.
Seniority: senior.
Applications are handled by Amazon. Apply on Amazon